AFS1500-1FGG676I

The AFS1500-1FGG676I is a Fusion® field programmable gate array (FPGA) offered in a 676-ball BGA package for surface-mount assembly. It provides a high-density programmable logic fabric with 38,400 logic elements and 1,500,000 gates, together with on-chip memory and a large complement of I/O for system integration.

Designed for industrial-grade use, the device supports an operating temperature range of −40 °C to 100 °C and operates from a single supplied core voltage between 1.425 V and 1.575 V, making it suitable for embedded systems that require extended temperature capability and extensive I/O connectivity.

Key Features

• Core Logic 38,400 logic elements delivering a total of 1,500,000 gates for implementing custom digital logic and control functions.
• Embedded Memory Approximately 0.276 Mbits of on-chip RAM available for buffering, FIFOs, and state storage directly inside the FPGA.
• I/O Density 252 user I/O pins to support multiple peripherals, parallel buses, and mixed-signal interfacing requirements.
• Packaging & Mounting Supplied in a 676-FBGA (27 × 27 mm) package; surface-mount mounting type for compact board-level integration.
• Power Core voltage supply range of 1.425 V to 1.575 V to match regulated power domains and system power rails.
• Temperature & Grade Industrial-grade device specified for operation from −40 °C to 100 °C to meet extended-environment requirements.
• Regulatory Compliance RoHS compliant, supporting environmental and material compliance requirements.

Typical Applications

• Industrial control systems — Implement custom control logic, sequencing, and interfacing in automation and process-control equipment that require industrial temperature capability.
• I/O-dense embedded platforms — Consolidate multiple peripheral interfaces and parallel buses using the device’s 252 I/O pins for compact system designs.
• System integration and glue logic — Replace discrete glue circuitry by implementing timing, protocol bridging, and custom logic functions directly in the FPGA fabric.

Unique Advantages

• Highly integrated programmable logic: 38,400 logic elements and 1,500,000 gates enable complex custom logic integration that reduces external component count.
• Significant I/O capability: 252 user I/Os allow direct connection to multiple peripherals, sensors, and buses without extensive external multiplexing.
• Embedded on-chip RAM: Approximately 0.276 Mbits of memory provides local buffering and fast data storage for low-latency designs.
• Industrial temperature rating: Specified for −40 °C to 100 °C operation to support deployments in demanding environmental conditions.
• Compact BGA footprint: 676-FBGA (27 × 27 mm) package enables high-density board layouts and reliable surface-mount assembly.
• RoHS compliant: Conforms to material restrictions for environmentally conscious designs and manufacturing.

Why Choose AFS1500-1FGG676I?

The AFS1500-1FGG676I combines a high logic element count, substantial gate capacity, and a large I/O complement in a compact 676-FBGA package, making it a practical choice for engineers who need to integrate significant custom logic and peripheral connectivity on a single device. Its industrial-grade temperature range and defined core voltage window support robust deployment in embedded and industrial environments.

This device is suited to designs that require scalable programmable logic, on-chip memory for buffering, and a high number of I/Os—providing a balance of integration, predictable power requirements, and board-level density for long-term product development.

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