AFS1500-1FGG484

The AFS1500-1FGG484 is a Fusion® field programmable gate array from Microchip Technology, offering a high-density programmable fabric with 1,500,000 gates and 38,400 logic elements. Packaged in a 484-ball FPBGA (23×23 mm) and supporting 223 I/O pins, it is intended for commercial-grade applications that require substantial logic capacity and a compact board-level footprint.

With approximately 0.276 Mbits of on-chip RAM and a specified supply voltage range of 1.425 V to 1.575 V, the device addresses designs that need integrated logic, embedded memory, and a large I/O complement within a single FPGA package.

Key Features

• Core Logic  1,500,000 gates and 38,400 logic elements provide high logic density for complex programmable designs.
• Embedded Memory  Approximately 0.276 Mbits of on-chip RAM for localized data storage and buffering within the FPGA fabric.
• I/O Capacity  223 user I/O pins to support multiple external interfaces and board-level connectivity.
• Package  484-ball FPBGA (23×23 mm) package case (484-BGA) for a compact, surface-mount board implementation.
• Power  Specified operating voltage range of 1.425 V to 1.575 V to match platform power rails.
• Operating Temperature  Commercial temperature grade with an operating range of 0 °C to 85 °C.
• Compliance  RoHS compliant for conformance with common environmental requirements.

Typical Applications

• High-density digital logic  Designs that require extensive programmable logic resources can utilize the 1,500,000 gates and 38,400 logic elements to implement complex state machines and custom datapaths.
• I/O-rich interfacing  Boards requiring many external connections can leverage the device’s 223 I/O pins for multiple peripheral or bus interfaces.
• Embedded memory buffering  Systems needing on-chip RAM for small buffers or local data storage can use the approximately 0.276 Mbits of embedded memory.
• Compact board-level integration  The 484-FPBGA (23×23) package supports dense PCB layouts where board space and surface-mount mounting are important.

Unique Advantages

• High logic density: 1,500,000 gates and 38,400 logic elements enable consolidation of large amounts of digital logic into a single device, reducing component count.
• Substantial I/O capability: 223 I/O pins provide flexibility to connect multiple peripherals, sensors, or buses without additional interface chips.
• On-chip memory: Approximately 0.276 Mbits of embedded RAM supports local buffering and state storage, simplifying board-level memory requirements.
• Compact FPBGA packaging: The 484-ball FPBGA (23×23) package offers a high-pin-count solution in a compact surface-mount form factor for space-constrained designs.
• Defined commercial operating range: Rated for 0 °C to 85 °C operation for use in standard commercial environments.
• RoHS compliant: Meets RoHS environmental requirements for lead-free assembly and regulatory alignment.

Why Choose AFS1500-1FGG484?

The AFS1500-1FGG484 positions itself as a high-capacity Fusion® FPGA option from Microchip Technology that combines significant programmable logic, embedded RAM, and a large I/O count in a compact 484-FPBGA package. Its specifications make it suitable for commercial designs that require consolidation of complex logic functions and multiple external interfaces on a single programmable device.

For teams targeting board-level integration where logic density, I/O flexibility, and a defined supply and temperature window are key selection criteria, the AFS1500-1FGG484 offers a clear, specification-driven choice backed by Microchip’s Fusion® FPGA family.

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