AFS1500-1FG676I

The AFS1500-1FG676I is a Fusion® field programmable gate array (FPGA) IC offering high-density logic and a broad industrial temperature range. It combines 38,400 logic elements, approximately 0.276 Mbits of embedded memory, and 252 user I/Os in a compact 676-FBGA (27×27) package for surface-mount PCB assembly.

Designed for industrial applications, the device operates from a supply voltage range of 1.425 V to 1.575 V and is specified for operation from -40°C to 100°C. The part is RoHS compliant.

Key Features

• Logic Capacity — 38,400 logic elements (equivalent logic cell count) supporting up to 1,500,000 gates for complex combinational and sequential logic implementation.
• On‑Chip Memory — Approximately 0.276 Mbits of total embedded RAM bits to support buffering, FIFOs, and small data storage on-chip.
• I/O Density — 252 user I/Os for flexible interface connectivity and parallel bus implementations.
• Power — Specified core supply voltage range of 1.425 V to 1.575 V for predictable power provisioning.
• Package & Mounting — Available in a 676-BGA package (supplier device package: 676-FBGA, 27×27) optimized for surface-mount assembly.
• Industrial Temperature Range — Rated for operation from -40°C to 100°C to meet industrial environment requirements.
• Regulatory Compliance — RoHS compliant.

Typical Applications

• Industrial control and automation — Use the device’s logic capacity and I/O density for custom control logic, signal aggregation, and protocol handling in industrial equipment.
• Embedded system integration — Implement glue logic, peripheral bridging, and on-board data handling where compact packaging and moderate on‑chip memory are required.
• Communications and interfaces — Leverage 252 I/Os to manage multiple parallel interfaces, custom signaling, and I/O-rich designs.

Unique Advantages

• High logic density: 38,400 logic elements and 1,500,000 gates enable implementation of sizable custom logic without off‑chip proliferation.
• Integrated embedded memory: Approximately 0.276 Mbits of on‑chip RAM reduces external memory dependence for moderate buffering and storage needs.
• Robust I/O capability: 252 I/Os provide flexible connectivity options for multi-channel and multi-interface designs.
• Industrial operating range: Specified -40°C to 100°C operation supports deployment in temperature-challenging environments.
• Compact BGA package: 676-FBGA (27×27) enables high-density PCB layouts while maintaining a surface-mount form factor.
• Regulatory readiness: RoHS compliance facilitates integration into assemblies with environmental material restrictions.

Why Choose AFS1500-1FG676I?

The AFS1500-1FG676I delivers a balance of logic capacity, embedded memory, and I/O density in a compact 676-BGA package targeted at industrial applications. Its defined supply voltage range and wide operating temperature make it suitable for designs that require stable operation across demanding environmental conditions.

This device is well suited for engineers and product teams building industrial control, embedded integration, or I/O‑rich systems that benefit from on‑chip logic and memory consolidation—helping reduce board-level complexity while providing a predictable component footprint.

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