AFS1500-1FGG256I

The AFS1500-1FGG256I is a Fusion® FPGA from Microchip Technology designed for industrial-grade embedded applications. It integrates 38,400 logic elements, approximately 0.28 Mbits of embedded memory, and 119 I/O pins in a compact 256-LBGA package.

With a nominal core supply range of 1.425 V to 1.575 V and an operating temperature range of −40 °C to 100 °C, this surface-mount FPGA targets robust designs that require moderate logic density, flexible I/O, and reliable operation in industrial environments.

Key Features

• Logic Capacity  38,400 logic elements supporting up to 1,500,000 gates for implementing custom hardware logic and control functions.
• Embedded Memory  Total on-chip RAM of 276,480 bits (approximately 0.28 Mbits) for local buffering, state storage, and small-data processing tasks.
• I/O  119 general-purpose I/O pins provide flexible interfaces for sensors, peripherals, and external logic.
• Package and Mounting  256-LBGA package (supplier device package: 256-FPBGA, 17×17) in a surface-mount form factor suitable for compact PCB layouts.
• Power  Core voltage supply range of 1.425 V to 1.575 V for predictable power delivery and design planning.
• Industrial Temperature Range  Rated for operation from −40 °C to 100 °C to meet industrial thermal requirements.
• Supply Chain and Compliance  RoHS-compliant construction to align with environmental regulatory requirements.

Typical Applications

• Industrial Control  Implements custom control logic, sequencing, and I/O aggregation for factory automation and process control systems operating across industrial temperature ranges.
• Sensor and I/O Aggregation  Serves as an interface and pre-processing hub for multiple sensors and peripherals using its 119 I/O pins and embedded memory for short-term buffering.
• Embedded System Acceleration  Offloads deterministic logic and timing-critical functions from processors using the FPGA's logic elements and gate capacity.

Unique Advantages

• Moderate Logic Density:  38,400 logic elements and 1,500,000 gates provide a balance of capacity for mid-size designs without excessive board-level complexity.
• Compact, Industry-Ready Packaging:  256-LBGA (256-FPBGA, 17×17) surface-mount package keeps PCB footprint compact while supporting industrial assembly processes.
• Industrial Temperature Range:  Rated −40 °C to 100 °C for deployment in harsh or variable-temperature environments.
• Predictable Power Envelope:  Defined supply voltage range (1.425 V to 1.575 V) simplifies power-supply design and voltage regulation planning.
• RoHS Compliance:  Environmentally compliant manufacturing reduces regulatory hurdles in product development.

Why Choose AFS1500-1FGG256I?

The AFS1500-1FGG256I positions itself as a practical Fusion® FPGA option for industrial engineers and embedded designers who need reliable mid-range logic capacity, flexible I/O, and a compact BGA footprint. Its mix of 38,400 logic elements, embedded memory, and 119 I/Os supports a range of control, interfacing, and offload tasks in industrial applications.

Choosing this device supports scalable designs that require predictable supply and temperature characteristics, while RoHS compliance helps streamline product development and regulatory alignment.

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