AFS1500-2FGG484I

The AFS1500-2FGG484I is a Fusion Field Programmable Gate Array (FPGA) IC from Microchip Technology presented in a 484-ball FBGA package. It combines a sizable logic fabric with on-chip memory and a high I/O count to support configurable digital designs in industrial environments.

With 38,400 logic elements, approximately 0.276 Mbits of embedded memory, and 223 I/O pins, this device targets applications that require moderate gate density, extensive interfacing, and robust operating temperature range.

Key Features

• Core Logic — 38,400 logic elements (cells) and 1,500,000 gates provide the programmable logic capacity for complex digital functions and custom architectures.
• Embedded Memory — Total on-chip RAM of 276,480 bits (approximately 0.276 Mbits) for local buffering, state machines, and small lookup tables.
• I/O Density — 223 I/O pins to support broad interfacing requirements in mixed-signal and multi-peripheral systems.
• Package & Mounting — 484-BGA package (supplier device package: 484-FPBGA, 23×23) in a surface-mount form factor for board-level integration.
• Power — Core voltage supply range of 1.425 V to 1.575 V for defined power design and rail planning.
• Operating Range — Industrial-grade temperature rating from −40 °C to 100 °C for deployment in temperature-demanding applications.
• Compliance — RoHS compliant material status for regulatory and manufacturing conformance.

Typical Applications

• Industrial Control — Use the device’s industrial temperature rating and logic capacity for programmable control, sequencing, and I/O aggregation in automation systems.
• Embedded System Interfaces — Leverage 223 I/O pins and on-chip RAM for protocol bridging, custom peripheral interfaces, and real-time data handling.
• Prototyping and Custom Logic — Implement custom state machines and timing-critical logic using the 38,400 logic elements and available embedded memory for rapid development and iteration.

Unique Advantages

• Balanced Logic and Memory: 38,400 logic elements paired with approximately 0.276 Mbits of on-chip RAM enables efficient implementation of moderate-complexity designs without off-chip memory dependency.
• High I/O Count: 223 I/O pins simplify integration with multiple sensors, actuators, and peripheral devices, reducing external multiplexing needs.
• Industrial Temperature Rating: Specified operation from −40 °C to 100 °C supports deployments in harsh or temperature-variable environments.
• Compact BGA Package: 484-ball FPBGA (23×23) provides a high-pin-count footprint in a surface-mount form factor suitable for dense PCB layouts.
• Defined Power Envelope: Narrow core voltage range (1.425–1.575 V) helps with predictable power-supply design and margining.

Why Choose AFS1500-2FGG484I?

The AFS1500-2FGG484I positions itself as an industrial-grade Fusion FPGA option that combines a substantial logic fabric, embedded memory, and extensive I/O in a compact 484-BGA package. Its specifications suit designers who need configurable logic capacity with on-chip resources and a clearly defined power and thermal envelope.

Manufactured by Microchip Technology, this part delivers a combination of integration and environmental robustness appropriate for control systems, embedded interfaces, and custom logic implementations where board-space efficiency and reliable operation across a wide temperature range are important.

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