AGL125V5-CS196
| Part Description |
IGLOO Field Programmable Gate Array (FPGA) IC 133 36864 3072 196-TFBGA, CSBGA |
|---|---|
| Quantity | 150 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 8 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 196-CSP (8x8) | Grade | Commercial | Operating Temperature | 0°C – 70°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 196-TFBGA, CSBGA | Number of I/O | 133 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 3072 | Number of Logic Elements/Cells | 3072 | ||
| Number of Gates | 125000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 36864 |
Overview of AGL125V5-CS196 – IGLOO Field Programmable Gate Array (FPGA), 133 I/O, 3,072 Logic Elements, 196-TFBGA
The AGL125V5-CS196 is an IGLOO field programmable gate array (FPGA) in a compact 196-TFBGA/CSBGA package. It provides 3,072 logic elements and 36,864 bits of on-chip RAM, together with 133 user I/O pins and an internal gate equivalence of 125,000 gates. Designed for surface-mount applications, this commercially graded FPGA targets embedded designs that require moderate logic density in a small footprint.
Key Features
- Core & Logic 3,072 logic elements providing programmable logic capacity; stated device equivalence of 125,000 gates for system-level sizing.
- Memory 36,864 bits of embedded on-chip RAM (approximately 0.037 Mbits) to support data buffering and small on-chip storage needs.
- I/O & Connectivity 133 user I/O pins suitable for multi-signal interfaces and peripheral connectivity in compact embedded systems.
- Power Supply Specified core supply voltage range of 1.425 V to 1.575 V to match tight design power rails.
- Package & Mounting Available in a 196-TFBGA (CSBGA) package; supplier device package listed as 196-CSP (8×8). Surface-mount mounting type for modern PCB assembly.
- Temperature & Grade Commercial grade device with an operating temperature range of 0 °C to 70 °C for standard commercial environments.
- Compliance RoHS compliant for regulatory and manufacturing compatibility.
Typical Applications
- Embedded control and glue logic Use the device’s 3,072 logic elements and 133 I/O pins to implement custom control paths and interface bridging between peripherals on compact PCBs.
- Peripheral interfacing On-chip RAM and abundant I/O support buffering and signal conversion tasks for sensors, displays, and communication modules in consumer and commercial products.
- Prototype and development boards The package density and gate-equivalent sizing make the FPGA suitable for prototype designs where a moderate programmable fabric is required for validation and iteration.
Unique Advantages
- Compact package footprint: The 196-TFBGA/196-CSP (8×8) packaging enables high-density board layouts and space-constrained designs.
- Balanced logic and memory: With 3,072 logic elements and 36,864 bits of on-chip RAM, the device supports combined control logic and modest buffering without external memory.
- Generous I/O: 133 user I/O pins provide flexibility for multi-channel interfacing and integration with a variety of peripherals.
- Clear power requirements: Tight supply voltage specification (1.425 V to 1.575 V) simplifies power rail design and voltage budgeting.
- Commercial temperature support: Rated 0 °C to 70 °C for deployment in standard commercial environments.
- Regulatory readiness: RoHS compliance supports environmentally responsible manufacturing and sourcing.
Why Choose AGL125V5-CS196?
The AGL125V5-CS196 delivers a compact, commercially rated FPGA solution that balances logic capacity, on-chip memory, and I/O resources in a small surface-mount package. Its specified gate equivalence and clear voltage and temperature ranges make it straightforward to plan around for embedded designs that require a reliable programmable fabric without oversized footprint or power complexity.
This part is well-suited for engineers and procurement teams designing commercial-grade embedded systems, prototype platforms, or compact control modules where moderate logic density, ample I/O, and RoHS compliance are required. The package and mounting choices support modern assembly flows and compact PCB implementations.
Request a quote or submit an inquiry to receive pricing and availability for AGL125V5-CS196 and to discuss fit for your next design.

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