AGL125V5-CS196I
| Part Description |
IGLOO Field Programmable Gate Array (FPGA) IC 133 36864 3072 196-TFBGA, CSBGA |
|---|---|
| Quantity | 1,585 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 52 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 196-CSP (8x8) | Grade | Industrial | Operating Temperature | -40°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 196-TFBGA, CSBGA | Number of I/O | 133 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 3072 | Number of Logic Elements/Cells | 3072 | ||
| Number of Gates | 125000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 36864 |
Overview of AGL125V5-CS196I – IGLOO Field Programmable Gate Array (FPGA), 196-TFBGA CSBGA
The AGL125V5-CS196I is an IGLOO Field Programmable Gate Array (FPGA) IC offering 3,072 logic elements and approximately 36.9 kbits of embedded RAM. It provides a gate count of 125,000 and 133 user I/O pins, packaged for compact surface-mount board integration.
Manufactured for industrial applications, this device is specified for a supply voltage range of 1.425 V to 1.575 V and an operating temperature range of −40 °C to 85 °C. The AGL125V5-CS196I ships in a 196-TFBGA / CSBGA footprint (supplier package: 196-CSP, 8×8) and is RoHS compliant.
Key Features
- Core Logic 3,072 logic elements delivering a configurable gate count of 125,000 for custom digital implementations.
- Embedded Memory Approximately 36.9 kbits of on-chip RAM for buffering, lookup tables, and small data storage tasks.
- I/O 133 general-purpose I/O pins allowing broad interfacing options for peripherals and external logic.
- Power Single-supply operation specified between 1.425 V and 1.575 V to match platform power rails.
- Package & Mounting 196-TFBGA / CSBGA package (supplier: 196-CSP, 8×8) in a surface-mount form factor for dense PCB layouts.
- Temperature & Grade Industrial grade device rated for operation from −40 °C to 85 °C for use in temperature-demanding environments.
- Compliance RoHS compliant to support lead-free assembly and regulatory requirements.
Typical Applications
- Industrial Control — Implement custom control logic, I/O aggregation, and signal conditioning for factory automation and process control.
- Embedded Systems — Provide programmable glue logic and peripheral interfacing within compact embedded platforms.
- Communications Equipment — Support protocol bridging, signal routing, and custom timing logic in networking and communications modules.
- Prototype and Development — Rapidly validate digital designs and iterate hardware functions using on-chip logic and memory resources.
Unique Advantages
- Balanced logic and memory capacity: 3,072 logic elements paired with approximately 36.9 kbits of embedded RAM enable a wide range of mid-density logic and buffering tasks.
- Ample I/O count: 133 I/O pins simplify board-level interfacing and reduce the need for additional I/O expanders.
- Compact BGA footprint: 196-TFBGA / CSBGA (196-CSP, 8×8) package supports high-density PCB designs while maintaining surface-mount assembly.
- Industrial-rated operation: Specified for −40 °C to 85 °C operation to meet requirements of industrial deployments.
- Controlled supply range: Defined 1.425 V to 1.575 V supply requirement supports predictable power budgeting and system integration.
- RoHS compliant: Meets lead-free manufacturing requirements for modern electronics assembly.
Why Choose AGL125V5-CS196I?
The AGL125V5-CS196I delivers a compact, industrial-grade FPGA option with a balanced combination of logic elements, embedded RAM, and a high I/O count in a 196-pin BGA package. Its defined voltage and temperature specifications make it suitable for engineers seeking a deterministic, surface-mount programmable logic solution for industrial and embedded applications.
This device is appropriate for design teams that need mid-density programmable logic to consolidate functions, prototype new digital systems, or implement custom interfacing without increasing board complexity. RoHS compliance and a standardized BGA footprint help streamline manufacturing and long-term deployment.
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Date Founded: 1989
Headquarters: Chandler, Arizona, USA
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