AGLP030V5-CS289I

The AGLP030V5-CS289I is an IGLOO PLUS Field Programmable Gate Array (FPGA) IC from Microchip Technology. It provides a mid-density logic fabric with 792 logic elements and approximately 30,000 gates in a compact 289‑TFBGA (CSBGA) package, aimed at applications requiring board-level integration and deterministic I/O routing.

With 120 general-purpose I/O, an industrial operating temperature range and a defined core supply range, this device is suited to industrial and embedded applications that demand stable operation across temperature and a compact package footprint.

Key Features

• Logic Capacity — 792 logic elements and approximately 30,000 gates to implement combinational and control logic for mid-density designs.
• I/O Count — 120 user I/O pins to support multiple interfaces, sensors and control signals without extensive external glue logic.
• Power — Operates from a defined core voltage supply range of 1.425 V to 1.575 V, enabling predictable power design and stable core operation.
• Package & Mounting — 289‑TFBGA (CSBGA) package, supplier device package 289‑CSP (14×14), and surface‑mount mounting type for compact PCB implementation.
• Temperature & Grade — Industrial grade with an operating temperature range of −40 °C to 100 °C for demanding environmental conditions.
• Compliance — RoHS compliant to meet environmental material requirements.

Typical Applications

• Industrial Control — Implement control logic and interface functions that operate across industrial temperature ranges for factory automation and process control equipment.
• Sensor and I/O Aggregation — Aggregate and manage multiple sensor inputs and digital signals using the device’s 120 I/O pins for compact embedded systems.
• Protocol Bridging and Glue Logic — Provide mid-density logic and I/O to bridge peripherals, implement protocol translators or replace discrete glue components on space-constrained PCBs.

Unique Advantages

• Balanced Logic Density: 792 logic elements and ~30,000 gates deliver enough capacity for mid-range integration while keeping board area and power predictable.
• High I/O Bandwidth: 120 I/O pins reduce the need for external expanders and simplify routing for multi‑signal designs.
• Compact, Surface‑Mount Package: 289‑TFBGA (14×14 CSP footprint) supports high-density PCB layouts and automated assembly processes.
• Industrial Reliability: Specified for −40 °C to 100 °C operation and listed as industrial grade for use in harsh environments.
• Predictable Power Requirements: Narrow supply range (1.425–1.575 V) aids in stable power-supply design and integration.
• Regulatory Compliance: RoHS compliance helps simplify material and environmental compliance for end equipment.

Why Choose AGLP030V5-CS289I?

The AGLP030V5-CS289I positions itself as a compact, industrial-grade FPGA option for mid-density logic integration. Its combination of 792 logic elements, 120 I/O and a 289‑TFBGA surface-mount package makes it a practical choice for embedded and industrial designers seeking to consolidate discrete logic and interface functions into a single programmable device.

Backed by Microchip Technology as the manufacturer, this FPGA provides a clear specification set—power, I/O and temperature—that supports predictable system-level design and deployment in industrial environments.

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