APA450-BGG456I

The APA450-BGG456I is a ProASICPLUS field programmable gate array (FPGA) presented in a 456-ball BGA package. It delivers a balance of logic capacity, embedded memory, and high pin count for designs that require configurable digital logic in an industrial-grade package.

With 12,288 logic elements, approximately 0.11 Mbits of embedded memory, 344 I/O pins and support for a 2.3–2.7 V supply, this device targets applications that demand significant on-chip logic and I/O integration while operating across an industrial temperature range.

Key Features

• Core Logic  12,288 logic elements providing a programmable fabric sized for mid-range logic integration; rated at approximately 450,000 gates.
• Embedded Memory  Total on-chip RAM of 110,592 bits (approximately 0.11 Mbits) to support buffering, small lookup tables, and state storage.
• High I/O Count  344 general-purpose I/O pins to support complex peripheral interfacing and high-density board connectivity.
• Power  Operates from a 2.3 V to 2.7 V supply range to match systems with low-voltage core rails.
• Package & Mounting  456-BBGA package (supplier device package: 456-PBGA, 35×35 mm) with surface-mount mounting for compact, board-level integration.
• Industrial Temperature Range  Specified for operation from −40 °C to 85 °C for use in industrial environments.
• Environmental Compliance  RoHS-compliant construction to support regulatory and environmental requirements in production designs.

Typical Applications

• Industrial Control and Automation  Use the device where industrial temperature operation and a high I/O count are needed for sensor interfaces, motor control logic, and I/O aggregation.
• Communications Infrastructure  Suitable for mid-range protocol processing, interface bridging, and custom packet handling with available on-chip memory and abundant I/O.
• Instrumentation and Test Equipment  Implement custom measurement logic, data conditioning, and control functions that benefit from programmable logic and embedded RAM.

Unique Advantages

• Significant Logic Density:  12,288 logic elements (approximately 450,000 gates) enable consolidation of multiple discrete functions into a single programmable device.
• Substantial I/O Integration:  344 I/O pins reduce the need for external I/O expanders and simplify board-level connectivity for complex systems.
• On-Chip Memory:  Approximately 0.11 Mbits of embedded RAM provides local storage for buffering, state machines, and lookup functions without external memory.
• Industrial Robustness:  Specified operation from −40 °C to 85 °C supports deployment in industrial environments where extended temperature tolerance is required.
• Compact Packaging:  456-ball BGA in a 35 × 35 mm footprint enables a high-pin-count solution while preserving PCB area for other components.
• Regulatory Readiness:  RoHS compliance assists with environmental and manufacturing requirements.

Why Choose APA450-BGG456I?

The APA450-BGG456I positions itself as a mid-range ProASICPLUS FPGA that combines a substantial logic element count with generous I/O and embedded memory in a BGA package suited for industrial applications. Its 2.3–2.7 V supply compatibility and −40 °C to 85 °C operating range make it appropriate for systems that require both programmability and robustness.

This device is well suited for engineers and designers consolidating embedded logic, custom interfaces, or protocol functions in industrial controls, communications equipment, and instrumentation. The combination of logic capacity, on-chip RAM, and high pin count provides a scalable, integrated option backed by industry-standard packaging and RoHS compliance.

Request a quote or submit a sales inquiry to receive pricing and availability details for the APA450-BGG456I and support for your design requirements.