APA450-BG456

The APA450-BG456 is a ProASICPLUS Field Programmable Gate Array (FPGA) supplied in a 456-BBGA surface-mount package. It provides a mid-range logic resource set including 12,288 logic elements, approximately 110,592 bits of embedded memory and up to 344 user I/O pins.

Designed for commercial-grade applications, the device operates from a 2.3 V to 2.7 V supply and across a 0 °C to 70 °C operating range, delivering a compact, high-density programmable logic option in a 456-ball PBGA (35×35) footprint.

Key Features

• Core Logic 12,288 logic elements (CLBs) and approximately 450,000 gates provide the device’s programmable logic capacity for glue logic, state machines and custom datapaths.
• Embedded Memory Approximately 110,592 bits of on-chip RAM to support buffering, FIFOs and state storage within user logic.
• I/O Density Up to 344 user I/O pins enable high pin-count interfacing for multiple buses, peripherals and external devices.
• Power Operates from a 2.3 V to 2.7 V supply range to match common system power rails.
• Package & Mounting 456-BBGA package (supplier device package: 456-PBGA 35×35) in a surface-mount form factor for high-density board designs.
• Grade & Temperature Commercial grade device with an operating temperature range of 0 °C to 70 °C.
• Environmental Compliance RoHS-compliant construction for regulatory and manufacturing requirements.

Typical Applications

• Embedded Control and Interface Bridging Use the device’s 344 I/Os and 12,288 logic elements to implement protocol translators, bus bridging and custom I/O conditioning in embedded systems.
• High-Density I/O Systems Suited for applications that require many parallel interfaces or multiplexed sensor/actuator connections thanks to its large I/O count.
• Memory-Assisted Logic Designs that need on-chip buffering, small FIFOs or local state storage can leverage the approximately 110,592 bits of embedded RAM.

Unique Advantages

• Balanced Logic and Memory Mix Combines 12,288 logic elements with substantial on-chip memory to support a wide range of mid-density logic and data buffering tasks.
• High I/O Capacity 344 I/O pins provide flexibility for multi-interface designs without requiring external I/O expanders.
• Compact Ball-Grid Packaging The 456-BBGA (456-PBGA, 35×35) surface-mount package enables high-density PCB layouts while keeping the overall solution compact.
• Commercial Temperature Suitability Rated for 0 °C to 70 °C operation to match mainstream commercial electronics deployments.
• RoHS Compliant Meets RoHS requirements for lead-free manufacturing and assembly processes.

Why Choose APA450-BG456?

The APA450-BG456 delivers a practical combination of logic density, embedded memory and high I/O count in a compact 456-BBGA surface-mount package, making it well suited for commercial embedded designs that require programmable logic, substantial interfacing and on-chip data storage. Its 2.3 V to 2.7 V supply compatibility and RoHS compliance simplify integration into modern commercial product stacks.

This device is appropriate for engineers seeking a mid-range FPGA option that balances integration and board-space efficiency while providing the programmable resources needed for protocol bridging, I/O consolidation and moderate memory-assisted logic functions.

Request a quote or submit a sales inquiry to obtain pricing and availability for the APA450-BG456.