APA300-PQG208I

The APA300-PQG208I is a ProASICPLUS Field Programmable Gate Array (FPGA) IC from Microchip Technology, designed for industrial applications. It provides a mid-range logic density with 300,000 gates and 8,192 logic elements, combined with on-chip embedded memory and a 158-pin I/O count for flexible system integration.

Specified for surface-mount PCB assembly in a 208-BFQFP (supplier package: 208-PQFP, 28×28) and rated for industrial temperature operation, this device targets systems that require a balance of logic capacity, I/O count, and robust environmental range.

Key Features

• Core Logic Density 300,000 gates and 8,192 logic elements provide capacity for medium-complexity custom logic and control functions.
• Embedded Memory Approximately 0.074 Mbits (73,728 bits) of on-chip RAM for buffering, state storage, and small data tables.
• I/O Count 158 I/O pins to support multiple peripheral interfaces, signal routing, and I/O aggregation on a single device.
• Power Supply Operates from a 2.3 V to 2.7 V supply range to match system voltage domains.
• Package & Mounting Delivered in a 208-BFQFP surface-mount package (supplier device package: 208-PQFP, 28×28) for compact PCB layout and automated assembly.
• Industrial Grade & Temperature Range Rated for industrial operation with an operating temperature range of -40 °C to 85 °C.
• Regulatory Compliance RoHS compliant device meeting standard lead-free material requirements.

Typical Applications

• Industrial Control & Automation Use the industrial-grade device and wide operating temperature range for digital control, I/O expansion, and signal processing in automation equipment.
• Embedded System Glue Logic 8,192 logic elements and 158 I/O allow consolidation of custom interfacing, bus bridging, and protocol adaptation in embedded designs.
• Communication & Interface Processing 300,000 gates with on-chip RAM provide resources for packet handling, custom protocol logic, and timing-critical interface functions.
• Compact PCB Integrations The 208-BFQFP surface-mount package supports dense PCB layouts where board space and automated assembly are required.

Unique Advantages

• Balanced Logic and Memory Combines 300,000 gates with approximately 0.074 Mbits of embedded RAM to implement state machines, FIFOs, and small buffers without external memory.
• Generous I/O Count 158 I/O pins reduce the need for additional I/O expanders and simplify system routing for multi-signal designs.
• Industrial Reliability Industrial-grade rating and -40 °C to 85 °C operating range support deployment in harsher environments.
• Low-Voltage Operation 2.3 V to 2.7 V supply compatibility enables integration into low-voltage system domains and modern power rails.
• Surface-Mount Package 208-BFQFP (208-PQFP, 28×28) package for compact board footprint and standard SMT assembly processes.
• RoHS Compliant Meets lead-free material requirements for environmentally conscious designs and supply chain compliance.

Why Choose APA300-PQG208I?

The APA300-PQG208I delivers a practical balance of logic density, on-chip memory, and a high I/O count in a surface-mount 208-BFQFP package, tailored for industrial-grade embedded designs. Its specification set—300,000 gates, 8,192 logic elements, 158 I/O, and industrial temperature rating—makes it suitable for designs that require reliable operation across a wide range of conditions while keeping board-level integration compact.

Produced by Microchip Technology as part of the ProASICPLUS family, this FPGA is a fit for engineers building medium-complexity custom logic, interface consolidation, and control systems that benefit from integrated RAM and extensive I/O in a RoHS-compliant package.

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