APA450-BG456I

The APA450-BG456I is a ProASICPLUS Field Programmable Gate Array (FPGA) IC from Microchip Technology. It combines moderate on-chip logic capacity with a high I/O count in a compact ball-grid package for embedded and industrial applications.

With 450,000 gates, 12,288 logic elements and 344 user I/O, this device targets designs that require substantial logic integration, extensive external connectivity, and operation across an industrial temperature range.

Key Features

• Logic Capacity  Provides 12,288 logic elements and a total of 450,000 gates to implement custom logic, glue functions, and moderate-complexity digital designs.
• Embedded Memory  Includes 110,592 bits of on-chip RAM (approximately 0.11 Mbits) for buffering, small lookup tables, and state storage.
• I/O and Package  Features 344 user I/O in a 456-BBGA package; supplier device package listed as 456-PBGA (35×35), supporting high pin-count connectivity in a surface-mount form factor.
• Power  Operates from a 2.3 V to 2.7 V supply range, allowing integration into lower-voltage power domains.
• Temperature and Grade  Rated for industrial operation from −40 °C to 85 °C and specified as Industrial grade for deployment in demanding environments.
• Compliance  RoHS compliant to support lead-free assembly and regulatory requirements.

Typical Applications

• Industrial Control  Implement custom control logic, I/O expansion and deterministic glue functions where industrial temperature operation and robust I/O count are needed.
• Data Acquisition and Sensor Interfaces  Aggregate and condition sensor signals with on-chip logic and memory to reduce external components and simplify board designs.
• Communications and Protocol Bridging  Translate and interface between multiple buses and peripherals using the device’s high I/O density to minimize external bridging chips.
• Custom Embedded Systems  Consolidate glue logic, state machines and peripheral controllers into a single programmable device to lower BOM and improve system integration.

Unique Advantages

• High Logic Integration: 450,000 gates and 12,288 logic elements enable substantial on-chip functionality, reducing the need for multiple discrete logic devices.
• Extensive Connectivity: 344 I/O pins support dense external interfacing and simplify routing of multiple peripherals or parallel buses.
• Industrial-Ready Thermal Range: Rated from −40 °C to 85 °C to meet the environmental requirements of many industrial deployments.
• Compact High-Pin Package: The 456-BBGA (456-PBGA, 35×35) surface-mount package provides a high pin count in a space-efficient footprint.
• Low-Voltage Operation: 2.3 V–2.7 V supply compatibility facilitates integration with lower-voltage system power rails.
• Regulatory Compliance: RoHS compliance supports lead-free manufacturing processes.

Why Choose APA450-BG456I?

The APA450-BG456I positions itself as a practical FPGA option for engineers needing a balance of logic capacity, onboard memory and extensive I/O in an industrial-grade package. Its combination of 12,288 logic elements, 344 I/O and a compact 456-BBGA package makes it well suited to embedded and industrial designs that require moderate complexity and high connectivity.

Manufactured by Microchip Technology and specified for industrial temperatures, the APA450-BG456I offers designers a reliable, scalable building block for consolidating digital functions, reducing board-level component count and simplifying system integration.

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