APA300-PQG208A

The APA300-PQG208A is a ProASICPLUS field programmable gate array (FPGA) manufactured by Microchip Technology. It provides a mid-density programmable logic resource with integrated on-chip memory and a substantial I/O count for embedded system designs.

With AEC-Q100 qualification and an operating range from -40 °C to 125 °C, the device targets applications that require automotive-grade qualification and robust temperature performance while operating at a core supply between 2.375 V and 2.625 V.

Key Features

• Configurable Logic — 8,192 logic elements supporting approximately 300,000 gates to implement custom digital logic functions.
• On-chip Memory — Approximately 73.7 kbits of embedded RAM to support buffers, state machines, and small data stores without external memory.
• I/O Density — 158 user I/O pins to interface directly with sensors, peripherals, and system buses.
• Automotive Qualification — AEC-Q100 qualification and an automotive grade listing for designs requiring that level of component qualification.
• Robust Temperature Range — Specified for operation from -40 °C to 125 °C to meet demanding thermal environments.
• Supply Voltage — Operates at a nominal supply range of 2.375 V to 2.625 V for compatibility with low-voltage system domains.
• Package & Mounting — 208-BFQFP surface-mount package (supplier device package: 208-PQFP, 28×28) for PCB assembly in space-constrained layouts.
• Environmental Compliance — RoHS compliant to meet common environmental requirements.

Typical Applications

• Automotive control modules — AEC-Q100 qualification and wide temperature range support in-vehicle digital logic and I/O consolidation.
• Embedded system controllers — Use the FPGA’s logic elements and on-chip RAM for custom control, sequencing, or protocol bridging tasks.
• High-density I/O interfaces — 158 I/O pins enable board-level signal aggregation and peripheral interfacing in compact packages.

Unique Advantages

• Automotive-qualified silicon: AEC-Q100 qualification and an automotive grade listing provide a clear pathway for automotive designs requiring qualified components.
• Balanced logic and memory: 8,192 logic elements combined with approximately 73.7 kbits of RAM allow integration of both control logic and modest data buffering on-chip.
• High I/O count in compact package: 158 I/O in a 208-BFQFP surface-mount package helps reduce external interface components and board complexity.
• Wide operating temperature range: Rated from -40 °C to 125 °C to support designs exposed to extended thermal environments.
• Low-voltage compatibility: Narrow supply window (2.375 V to 2.625 V) suited for systems using low-voltage domains.
• Regulatory readiness: RoHS compliance simplifies environmental qualification and regulatory acceptance.

Why Choose APA300-PQG208A?

The APA300-PQG208A positions itself as a robust, mid-density FPGA option for designs that require automotive-grade qualification, a high I/O count, and a mix of logic and on-chip memory. Its AEC-Q100 qualification, extended temperature rating, and compact 208-BFQFP surface-mount package make it suitable for embedded control and interface consolidation in demanding environments.

This device is well suited to engineers and procurement teams designing automotive or other temperature-critical systems who need a programmable, verifiable FPGA resource with clear electrical and package specifications. Its combination of logic elements, gate capacity, embedded RAM, and I/O density supports scalable integration while meeting qualification and environmental requirements.

Request a quote or submit an inquiry to obtain pricing and availability for the APA300-PQG208A and to discuss how it can fit into your next design.