APA300-PQ208A

The APA300-PQ208A is a ProASICPLUS field programmable gate array (FPGA) designed for embedded and system control applications requiring programmable logic, abundant I/O, and on-chip memory. It provides a mix of usable resources—approximately 300,000 gates, 8,192 logic elements and 73,728 bits of RAM—packaged in a 208-pin BFQFP surface-mount package.

With AEC-Q100 qualification, a wide operating temperature range and a narrow supply voltage window, this device targets applications that demand robustness across temperature extremes and controlled supply environments.

Key Features

• Core Logic — 300,000 gates and 8,192 logic elements provide programmable resources for control logic, state machines, and combinational/sequential designs.
• Embedded Memory — 73,728 total RAM bits of on-chip memory suitable for buffers, small lookup tables, and local data storage.
• I/O Density — 158 general-purpose I/Os for dense peripheral interfacing, sensor connections, and multi-channel I/O aggregation.
• Package & Mounting — 208-BFQFP (supplier package: 208-PQFP, 28×28) in a surface-mount form factor for PCB assembly and compact system integration.
• Power — Specified supply voltage range of 2.375 V to 2.625 V to match systems with tight core-voltage requirements.
• Temperature Range — Rated for operation from −40 °C to 125 °C, supporting deployment in temperature-challenging environments.
• Qualification — AEC-Q100 qualification and automotive grade designation for applications requiring automotive-level component qualification.
• RoHS Compliance — RoHS-compliant material status for environmentally regulated assemblies.

Typical Applications

• Automotive Control Systems — Use the AEC-Q100-qualified FPGA for control logic, sensor interfacing, and signal conditioning in automotive electronic modules operating across −40 °C to 125 °C.
• Embedded System Control — Implement custom state machines, protocol handling, and system glue logic utilizing the device’s 8,192 logic elements and 158 I/Os.
• I/O Aggregation and Bridging — Consolidate multiple peripherals and sensors through the high I/O count to reduce board-level complexity and component count.

Unique Advantages

• Automotive-Grade Qualification: AEC-Q100 qualification supports use in automotive and similarly demanding environments, reducing qualification overhead for end products.
• High I/O Count: 158 I/Os enable dense peripheral connectivity and flexible pin assignments for complex system designs.
• Balanced Logic and Memory: 8,192 logic elements combined with 73,728 bits of on-chip RAM provide a balance between programmable logic and local storage for control and buffering tasks.
• Temperature Resilience: −40 °C to 125 °C operating range supports deployment in temperature-extreme applications without additional thermal derating.
• Compact Surface-Mount Package: 208-BFQFP (28×28) surface-mount package simplifies PCB layout while preserving access to a large number of I/Os.

Why Choose APA300-PQ208A?

The APA300-PQ208A positions itself as a robust, automotive-qualified FPGA option for designers who need a balanced combination of logic capacity, on-chip memory and extensive I/O in a compact surface-mount package. Its AEC-Q100 qualification and wide operating temperature range make it suitable for applications where reliability under harsh conditions is required.

This device is appropriate for engineers building embedded control, I/O aggregation, or automotive electronic solutions that require programmable flexibility, predictable power requirements (2.375 V–2.625 V), and a high pin count for system integration.

Request a quote or contact sales to discuss availability, pricing, and how the APA300-PQ208A can fit your next design.