APA300-FGG256A

The APA300-FGG256A is a ProASICPLUS field programmable gate array (FPGA) in a 256-LBGA package designed for applications requiring moderate logic density, on-chip memory and a high I/O count. With 8,192 logic elements, approximately 0.0737 Mbits of embedded RAM, and 186 I/O, it targets designs that need flexible digital integration in compact, surface-mount form factors.

Electrical and environmental specs — including a 2.375 V to 2.625 V supply range, AEC-Q100 qualification and an operating temperature range of −40 °C to 125 °C — make this device suitable for automotive-grade applications and other environments that demand defined temperature and reliability characteristics.

Key Features

• Core Logic  8,192 logic elements providing a programmable fabric for custom digital functions and glue logic.
• On‑chip Memory  73,728 bits (approximately 0.0737 Mbits) of embedded RAM for data buffering, state storage and small FIFOs.
• I/O and Gate Capacity  186 I/O pins and roughly 300,000 gates to support complex interfacing and parallel connectivity.
• Power  Single supply operation over a 2.375 V to 2.625 V range to match compatible system power rails.
• Temperature Range  Qualified for operation from −40 °C to 125 °C to meet extended-temperature system requirements.
• Package & Mounting  256-LBGA (supplier: 256-FPBGA, 17 × 17 mm) surface-mount package for compact board-level integration.
• Automotive Qualification  AEC-Q100 qualification and automotive grade designation for designs that require automotive-level component qualification.
• Compliance  RoHS compliant to support regulatory and assembly requirements.

Typical Applications

• Automotive control modules  Use in automotive electronic subsystems where AEC-Q100 qualification and the −40 °C to 125 °C range are required for reliable operation.
• High-density I/O systems  Ideal for designs requiring up to 186 I/O lines for sensor arrays, bus interfacing or multi-channel control.
• Embedded logic and glue circuits  Implement protocol bridging, custom finite-state machines and peripheral aggregation using 8,192 logic elements and on-chip RAM.
• Space-constrained boards  The 256-LBGA (17 × 17 mm) surface-mount package provides a compact footprint for tightly packaged electronic assemblies.

Unique Advantages

• AEC‑Q100 Qualified: Meets automotive qualification requirements for designs that require verified component reliability.
• High I/O Count: 186 I/O pins reduce the need for additional interface components and simplify board-level routing for multi-signal systems.
• Balanced Logic and Memory: 8,192 logic elements combined with approximately 0.0737 Mbits of embedded RAM support a wide range of control and buffering tasks.
• Wide Operating Temperature: Rated from −40 °C to 125 °C for deployment in temperature-demanding environments.
• Compact Surface‑Mount Package: 256-LBGA (256-FPBGA, 17 × 17) enables dense PCB integration while maintaining robust solderability for surface-mount assembly.

Why Choose APA300-FGG256A?

The APA300-FGG256A positions itself as a compact, automotive‑qualified FPGA option that balances logic density, embedded memory and a high I/O count in a surface-mount 256-LBGA package. Its defined supply range and extended temperature rating make it suitable for engineers designing robust embedded systems that must meet automotive qualification standards.

This device is well suited for teams needing a programmable, compact solution for interfacing, control logic and moderate on-chip buffering. Its combination of AEC-Q100 qualification, RoHS compliance and board-friendly package supports long-term product development and integration into vehicle or other temperature-critical electronic systems.

Request a quote or submit an inquiry to check availability and discuss how APA300-FGG256A can meet your application requirements.