APA300-FGG144I

The APA300-FGG144I is a ProASICPLUS field programmable gate array (FPGA) IC from Microchip Technology, offered in a 144-LBGA (144-FPBGA 13×13) package. It provides embedded programmable logic with on-chip RAM and a broad I/O count targeted at applications that require configurable logic in an industrial-grade package.

Key architectural attributes include 8,192 logic elements, 73,728 total RAM bits, and 100 I/O pins, delivering a balance of logic capacity, embedded memory, and connectivity for configurable designs.

Key Features

• Core Logic 8,192 logic elements and an estimated 300,000 gates provide the programmable fabric for custom logic implementation.
• Embedded Memory 73,728 total RAM bits of on-chip memory (approximately 0.074 Mbits) to support data buffering, state machines, and small RAM-based functions without external memory.
• I/O Capacity 100 I/O pins to support multiple interfaces, signal routing, and peripheral connections in compact systems.
• Power Operates from a 2.3 V to 2.7 V supply range, allowing straightforward integration into systems with mid-range core voltages.
• Package & Mounting 144-LBGA package (supplier device package: 144-FPBGA, 13×13) with surface-mount mounting type for compact board-level integration.
• Industrial Temperature Range Rated for operation from −40 °C to 85 °C, suitable for industrial environments requiring extended temperature tolerance.
• Environmental Compliance RoHS compliant to meet common environmental and manufacturing standards.

Typical Applications

• Industrial Control Use the APA300-FGG144I for programmable control logic, I/O aggregation, and interface handling in industrial automation systems where industrial temperature rating is required.
• Embedded Systems Implement custom data paths, peripheral controllers, or protocol bridging using the device’s 8,192 logic elements and on-chip memory.
• I/O Expansion and Interface Bridging Leverage 100 I/Os to consolidate multiple signals or adapt between subsystems without extensive external glue logic.
• Prototyping and Custom Logic Deploy the FPGA for development of bespoke logic functions and hardware acceleration in compact LBGA form factors.

Unique Advantages

• Balanced Logic and Memory: 8,192 logic elements combined with 73,728 bits of on-chip RAM allow integration of control logic and small data buffers without additional external memory.
• Substantial I/O Count: 100 I/Os give flexibility to connect multiple peripherals and sensors directly to the programmable fabric, reducing external components.
• Industrial-Grade Operation: Rated from −40 °C to 85 °C for deployments in environments that demand wider temperature tolerance.
• Compact, Surface-Mount LBGA Package: The 144-LBGA (13×13) package supports high-density board designs while maintaining a surface-mount form factor for automated assembly.
• Wide Supply Range Compatibility: 2.3 V to 2.7 V supply range facilitates integration into systems using common core voltage rails.
• RoHS Compliant: Meets RoHS requirements for environmentally conscious manufacturing and supply-chain compliance.

Why Choose APA300-FGG144I?

The APA300-FGG144I is positioned as an industrial-grade, mid-capacity programmable logic device that balances logic resources, embedded RAM, and I/O density in a compact LBGA package. Its specifications make it suitable for engineers designing industrial control modules, embedded systems, and interface bridging solutions that require configurable logic within a defined temperature and voltage envelope.

With RoHS compliance and a standardized 144-LBGA footprint, the APA300-FGG144I offers a practical option for designs that need on-chip memory and significant I/O without expanding board area or BOM complexity.

Request a quote or submit an inquiry to receive pricing, availability, and ordering information for the APA300-FGG144I.