APA300-FG256M

The APA300-FG256M is a ProASICPLUS Field Programmable Gate Array (FPGA) IC offering deterministic, reprogrammable logic with 8192 logic elements and approximately 0.074 Mbits of embedded memory. Designed and qualified for military use, it provides a compact, surface-mount FPGA solution for designs that require rugged operation and high I/O density.

Its combination of 186 I/O, 300,000 gates and MIL-STD-883 qualification makes the APA300-FG256M suited for systems that demand extended temperature operation, controlled-power rails, and proven manufacturing qualification.

Key Features

• Core Logic 8192 logic elements and 300,000 gates deliver programmable logic capacity for control, glue-logic, and moderate-density FPGA designs.
• Embedded Memory Approximately 0.074 Mbits (73,728 bits) of on-chip RAM for small data buffering, state storage, and internal FIFO implementation.
• I/O Density 186 user I/O pins support high-pin-count interfaces and multi-signal connectivity in a single device footprint.
• Package and Mounting 256-LBGA (supplier package: 256-FPBGA, 17×17) in a surface-mount package suitable for compact board layouts.
• Power Single-supply operation from 2.3 V to 2.7 V to match system power architectures that use tightly controlled core rails.
• Reliability and Qualification Military grade with MIL-STD-883 qualification and an operating temperature range of −55 °C to 125 °C for rugged, temperature-extreme applications.
• Environmental Compliance RoHS compliant to support environmentally conscious manufacturing and assembly processes.

Typical Applications

• Military and Aerospace Electronics — MIL-STD-883 qualification and −55 °C to 125 °C operation support avionics, ruggedized computing, and mission-critical subsystems.
• Embedded Control Systems — Logic capacity and I/O count make the device suitable for real-time control, protocol bridging, and custom state machines.
• Communications Equipment — High I/O density enables implementation of interface logic and packet handling functions in communications line cards and radios.

Unique Advantages

• Qualified for Military Use: MIL-STD-883 qualification provides a proven manufacturing and test baseline for defense and aerospace programs.
• Extended Temperature Range: Operation from −55 °C to 125 °C supports deployment in harsh thermal environments without additional thermal derating.
• Compact High-Pin Package: The 256-LBGA (17×17 FPBGA) package delivers 186 I/Os in a space-efficient surface-mount form factor for dense board designs.
• Controlled Voltage Supply: 2.3 V to 2.7 V supply range aligns with systems using low-voltage core rails to simplify power distribution.
• On-Chip Memory for Local Data Handling: Approximately 0.074 Mbits of embedded RAM supports buffering and state retention without external memory.

Why Choose APA300-FG256M?

The APA300-FG256M positions itself as a reliable, military-qualified FPGA option where robust operation, high I/O count, and deterministic programmable logic are required. Its blend of 8192 logic elements, significant gate count, and on-chip memory provide a balanced platform for embedded control, interface logic, and mid-density processing tasks.

This device is ideal for engineers and procurement teams specifying components for defense, aerospace, and other temperature-extreme or qualification-driven programs. With MIL-STD-883 qualification, RoHS compliance, and a compact 256-LBGA package, the APA300-FG256M offers long-term manufacturability and integration into rugged system designs.

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