APA300-FGG144

The APA300-FGG144 is a ProASICPLUS Field Programmable Gate Array (FPGA) IC from Microchip Technology designed for commercial-grade programmable logic applications. It integrates a moderate logic capacity with on-chip RAM and a flexible I/O complement in a compact BGA package.

With a supply range of 2.3 V to 2.7 V, 100 user I/O, approximately 73,728 bits of embedded memory, and 8,192 logic elements, the device targets commercial designs that require configurable logic, interface flexibility, and RoHS-compliant hardware.

Key Features

• Core Logic Approximately 300,000 gates and 8,192 logic elements provide the programmable logic capacity for custom functions and glue logic.
• Embedded Memory Approximately 73,728 bits of on-chip RAM for buffering, small lookup tables, and state storage without external memory.
• I/O 100 user I/O pins for interfacing with peripherals, sensors, and other digital subsystems.
• Power Operates from a 2.3 V to 2.7 V supply, suitable for low-voltage commercial designs.
• Package & Mounting 144-LBGA package (supplier device package: 144-FPBGA, 13×13) configured for surface-mount assembly.
• Operating Range Commercial grade with an operating temperature range of 0 °C to 70 °C.
• Environmental Compliance RoHS compliant to support lead-free manufacturing processes.

Typical Applications

• Commercial embedded systems — Use the FPGA to implement custom logic and I/O control in commercial products that require up to 100 I/O and moderate on-chip memory.
• Interface bridging and glue logic — Implement protocol adaptation, signal aggregation, or timing control using the device’s 8,192 logic elements and available RAM.
• Prototyping and custom logic — Rapidly develop and validate custom digital functions where a compact 144-LBGA package and surface-mount mounting are required.

Unique Advantages

• Moderate programmable capacity: 8,192 logic elements and ~300,000 gates provide substantial room for custom logic without external ASIC development.
• On-chip memory: Approximately 73,728 bits of embedded RAM reduce the need for small external memory components for buffering and state machines.
• Flexible interfacing: 100 user I/O pins enable connection to a variety of peripherals and digital subsystems.
• Compact, surface-mount package: 144-LBGA (144-FPBGA, 13×13) keeps board area low while supporting standard surface-mount assembly processes.
• Commercial-grade suitability: Specified operating range of 0 °C to 70 °C aligns with commercial product requirements.
• RoHS compliant: Supports lead-free manufacturing and regulatory requirements for commercial electronics.

Why Choose APA300-FGG144?

The APA300-FGG144 delivers a balanced combination of logic density, embedded memory, and I/O capacity in a compact BGA package from Microchip Technology. Its specifications—8,192 logic elements, roughly 73,728 bits of on-chip RAM, 100 I/O, and a 2.3 V to 2.7 V supply range—make it well suited for commercial designs that need configurable digital logic and interface flexibility.

Choose APA300-FGG144 for commercial projects that require a programmable, RoHS-compliant FPGA with moderate resources and a compact surface-mount footprint.

Request a quote or submit an inquiry to receive pricing and availability information for APA300-FGG144.