APA300-FGG256

The APA300-FGG256 is a ProASICPLUS field programmable gate array (FPGA) from Microchip Technology, delivered in a 256-LBGA package. It provides a mid-range programmable logic solution for commercial applications that require a balance of logic capacity, on-chip memory, and a high I/O count.

Designed for surface-mount assembly and commercial-temperature operation, this device targets embedded systems and other commercial designs that need configurable logic and substantial I/O connectivity within a compact footprint.

Key Features

• Logic Capacity — Provides approximately 300,000 gates and 8,192 logic elements for implementing custom digital logic and control functions.
• On‑chip Memory — Includes 73,728 bits of embedded RAM (approximately 0.074 Mbits) to support buffering, small FIFOs, and local data storage.
• I/O Density — 186 general-purpose I/O pins to support multiple interfaces and parallel connections.
• Supply Voltage — Operates from a 2.3 V to 2.7 V supply range for compatibility with common commercial logic domains.
• Package and Mounting — Supplied in a 256-LBGA package (supplier device package: 256-FPBGA, 17×17) for compact, surface-mount board designs.
• Temperature Grade — Commercial grade with an operating temperature range of 0°C to 70°C.
• Compliance — RoHS compliant.

Typical Applications

• Commercial Embedded Systems — Implement custom control logic, signal conditioning, or glue logic in compact commercial devices.
• Communications Equipment — Handle protocol interfacing and I/O aggregation where configurable logic and multiple I/Os are required.
• Prototyping and Product Development — Provide a programmable platform for validating digital functions and iterating designs in commercial projects.

Unique Advantages

• High I/O Count: 186 I/Os enable direct connection to multiple peripherals and parallel interfaces, reducing external buffering requirements.
• Balanced Logic and Memory: Approximately 300,000 gates and 73,728 bits of RAM support a mix of control logic and local data storage in a single device.
• Compact BGA Package: The 256-LBGA (256-FPBGA 17×17) package delivers a small board footprint for space-constrained commercial applications.
• Commercial Temperature Rating: Rated 0°C to 70°C for typical commercial environments and deployments.
• Low-Voltage Operation: 2.3–2.7 V supply range aligns with common low-voltage system domains for streamlined power design.
• RoHS Compliant: Meets environmental compliance requirements for commercial products.

Why Choose APA300-FGG256?

The APA300-FGG256 delivers a practical combination of logic capacity, embedded memory, and high I/O density in a compact 256-LBGA package, making it well suited to commercial embedded designs that require programmable logic without excessive board area. As a ProASICPLUS device from Microchip Technology, it provides a commercially graded option for teams needing configurable hardware building blocks and reliable, repeatable behavior across production runs.

Choose this FPGA when your design calls for a mid-range programmable solution with substantial I/O, integrated RAM for local buffering, and a small surface-mount footprint that supports typical commercial operating conditions.

Request a quote or submit an inquiry to receive pricing and availability information for the APA300-FGG256.