APA300-FGG256I

The APA300-FGG256I is a ProASICPLUS field programmable gate array (FPGA) from Microchip Technology in a 256-LBGA surface-mount package. It delivers moderate-density programmable logic with 8,192 logic elements, 300,000 gates and approximately 0.074 Mbits of embedded memory, combined with 186 user I/O pins.

Designed as an industrial-grade device, this FPGA operates from 2.3 V to 2.7 V and across a −40°C to 85°C temperature range, making it suitable for embedded and industrial designs that require reliable logic integration in a compact package.

Key Features

• Core & Logic  8,192 logic elements and 300,000 gates provide moderate-density programmable logic suitable for control, glue logic, and data-path functions.
• Embedded Memory  Approximately 0.074 Mbits of on-chip RAM (73,728 total RAM bits) for local buffering and state storage.
• I/O Capacity  186 I/O pins to support multiple interfaces and peripheral connections on a single device.
• Power  Operates from a 2.3 V to 2.7 V supply range for compatibility with common system voltage domains.
• Package & Mounting  256-LBGA (supplier package 256-FPBGA, 17×17) in a surface-mount form factor for compact PCB designs.
• Industrial Temperature Range  Specified for operation from −40°C to 85°C to meet industrial environment requirements.
• Environmental Compliance  RoHS compliant to support regulatory and manufacturing requirements.
• Manufacturer  Microchip Technology

Typical Applications

• Industrial Control & Automation  Industrial-grade temperature range and 186 I/Os support sensor interfacing, control logic, and field I/O aggregation in automation systems.
• Embedded Systems  Use the device’s 8,192 logic elements and on-chip RAM for custom glue logic, protocol bridging, and local data buffering in embedded designs.
• Interface and Peripheral Management  High I/O count enables consolidation of multiple interfaces and peripheral control within a single compact FPGA package.

Unique Advantages

• Moderate-density integration: 8,192 logic elements and 300,000 gates allow integration of control and data-path functions that reduce external components.
• High I/O flexibility: 186 I/O pins enable extensive peripheral and interface consolidation, simplifying board-level design.
• Compact board footprint: 256-LBGA (256-FPBGA 17×17) surface-mount package supports space-constrained PCB layouts.
• Industrial readiness: Rated for −40°C to 85°C operation to meet temperature demands of industrial applications.
• Voltage compatibility: 2.3–2.7 V supply range aligns with common system rails for straightforward power integration.
• Regulatory compliance: RoHS compliance supports environmental and manufacturing requirements.

Why Choose APA300-FGG256I?

The APA300-FGG256I combines a balanced set of logic resources, on-chip memory and a high I/O count in a compact 256-LBGA package, making it a practical choice for designers who need moderate-density programmable logic with industrial operating range. Its specifications align with embedded and industrial applications that require reliable logic integration and flexible I/O connectivity.

Backed by Microchip Technology, this ProASICPLUS device offers a straightforward hardware building block for designs that prioritize integration, board density and industrial temperature performance while maintaining environmental compliance.

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