APA300-FGG144M

The APA300-FGG144M is a ProASICPLUS Field Programmable Gate Array from Microchip Technology designed for applications requiring a mix of logic density, on-chip memory, and broad I/O. It provides 8,192 logic elements (approximately 300,000 gates) and 73,728 bits of embedded RAM in a compact 144-LBGA package.

With a military grade qualification (MIL-STD-883), a wide operating temperature range and a 2.3 V to 2.7 V supply, this device targets high-reliability, harsh-environment embedded designs that need configurable logic and substantial I/O capability.

Key Features

• Core Logic — 8,192 logic elements delivering the equivalent of 300,000 gates for implementing custom digital functions and glue logic.
• On-chip Memory — 73,728 bits of embedded RAM for buffering, FIFOs, or small data stores directly inside the FPGA fabric.
• I/O Capacity — 100 user I/O pins to support interfacing with peripherals, sensors, and external logic.
• Voltage Supply — Operates from 2.3 V to 2.7 V, enabling designs targeting that supply domain.
• Package and Mounting — 144-LBGA (supplier package: 144-FPBGA, 13×13) in a surface-mount form factor for compact board integration.
• Rugged Qualification — Military grade with MIL-STD-883 qualification to meet strict reliability and screening requirements.
• Wide Operating Temperature — Rated from −55 °C to 125 °C for demanding thermal environments.
• Environmental Compliance — RoHS compliant.

Typical Applications

• Military and Defense Electronics — Implements custom logic, protocol bridging, and signal conditioning in systems that require MIL-STD-883 qualification and wide temperature operation.
• Rugged Embedded Control — Acts as the programmable heart of control systems where 100 I/O pins and on-chip RAM support sensor interfacing and local data buffering.
• Harsh-Environment Signal Processing — Provides deterministic, deployable logic and memory resources for processing tasks across −55 °C to 125 °C operating ranges.
• Compact I/O Expansion — Serves as a configurable I/O and glue-logic device in board designs requiring a high pin count in a 144-LBGA footprint.

Unique Advantages

• High logic capacity: 8,192 logic elements and ~300,000 gates allow integration of multiple custom functions into a single device, reducing component count.
• Embedded memory for local buffering: 73,728 bits of on-chip RAM minimizes external memory needs for small data stores and FIFO implementations.
• Robust environmental qualification: Military grade and MIL-STD-883 qualification combined with −55 °C to 125 °C operation support deployment in demanding applications.
• Wide I/O complement: 100 user I/Os facilitate direct interfacing with sensors, buses, and peripheral logic without added interface chips.
• Compact surface-mount package: 144-LBGA (13×13) enables dense PCB layouts while maintaining a high I/O count.
• Industry-standard supply domain: 2.3 V to 2.7 V operation fits designs that use common low-voltage rails.

Why Choose APA300-FGG144M?

The APA300-FGG144M delivers a balance of configurable logic, on-chip memory, and substantial I/O in a MIL-STD-883 qualified FPGA package. Its combination of 8,192 logic elements, 73,728 bits of RAM, and 100 I/O pins makes it suitable for compact, reliable designs that operate across a wide temperature range and require military-grade screening.

Designed for engineers developing rugged embedded systems and defense electronics, this ProASICPLUS device offers a predictable platform for integrating custom digital functions while minimizing external components and supporting long-term deployment requirements.

Request a quote or submit an inquiry to discuss availability and pricing for the APA300-FGG144M and to get assistance selecting the right configuration for your design.