APA300-FGG256M

The APA300-FGG256M is a ProASICPLUS field programmable gate array (FPGA) IC from Microchip Technology, delivered in a 256-LBGA package. It combines mid-range logic capacity, on-chip memory, and extensive I/O counts for use in systems that require military-grade qualification and extended temperature operation.

Designed for applications that demand reliability and rugged operation, this device is characterized by MIL-STD-883 qualification, a wide operating temperature range, and surface-mount packaging suitable for compact, high-density assemblies.

Key Features

• Logic Capacity  Approximately 8192 logic elements (cells) and 300,000 gates provide mid-range programmable logic resources for implementing custom digital functions.
• Embedded Memory  Approximately 0.074 Mbits of on-chip RAM (73,728 total bits) to support buffering, state storage, and local data processing.
• I/O Density  186 user I/O pins to support diverse peripheral interfaces and signal routing requirements in complex systems.
• Power  Operates from a 2.3 V to 2.7 V supply, enabling integration with low-voltage system rails.
• Package and Mounting  256-LBGA (supplier package: 256-FPBGA, 17 × 17 mm) in a surface-mount form factor for space-efficient board designs.
• Reliability and Qualification  Military-grade device qualified to MIL-STD-883 and specified for operation from −55 °C to 125 °C for rugged and high-reliability environments.
• Regulatory  RoHS compliant.

Typical Applications

• Defense and Military Electronics  Used for mission-critical control, signal processing, and I/O aggregation where MIL-STD-883 qualification and extended temperature range are required.
• Rugged Embedded Systems  Employed in industrial or field-deployed systems that need a balance of logic resources, on-chip memory, and abundant I/O in a compact package.
• Communications and Interface Control  Implements custom protocol bridging, interface control logic, and peripheral timing in systems with varied I/O requirements.

Unique Advantages

• Military-Grade Qualification:  MIL-STD-883 qualification and an operating range of −55 °C to 125 °C support deployment in harsh and high-reliability environments.
• Balanced Logic and Memory:  Approximately 8192 logic elements and 73,728 bits of on-chip RAM provide a compact combination of logic capacity and embedded memory for mid-size FPGA designs.
• High I/O Count:  186 I/O pins enable integration with multiple peripherals and signal domains without extensive external glue logic.
• Compact Surface-Mount Package:  256-LBGA (17 × 17 mm) offers a space-efficient footprint suitable for dense board layouts.
• Low-Voltage Operation:  2.3 V to 2.7 V supply compatibility facilitates integration into low-voltage system architectures.
• RoHS Compliant:  Meets environmental regulation requirements for lead-free assemblies.

Why Choose APA300-FGG256M?

The APA300-FGG256M is positioned for designs that require a mid-range FPGA with military qualification and a robust operating temperature window. With a combination of approximately 8192 logic elements, 73,728 bits of embedded RAM, and 186 I/O, it addresses applications that need reliable programmable logic, moderate on-chip memory, and substantial external connectivity in a compact LBGA package.

Manufactured by Microchip Technology and qualified to MIL-STD-883, this device is suited to engineers specifying components for rugged embedded, defense, and other high-reliability systems that demand verified qualification and extended temperature operation.

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