APA300-PQ208M

The APA300-PQ208M is a ProASICPLUS FPGA offered by Microchip Technology, delivered in a 208-pin BFQFP surface-mount package. It provides a balanced combination of logic density, on-chip RAM, and a high I/O count for designs that require MIL-STD-883 qualification and extended temperature operation.

Designed for applications that demand reliability and deterministic programmable logic, this device supports moderate gate and memory resources while operating at low core voltages and across a wide military temperature range.

Key Features

• Core Logic — Approximately 300,000 gates and 8,192 logic elements provide the programmable fabric for custom logic, state machines, and glue-logic implementations.
• Embedded Memory — 73,728 bits of on-chip RAM for buffering, small lookup tables, and temporary storage within user logic.
• I/O Density — 158 user I/O pins to support parallel interfaces, multi-signal sensor arrays, and mixed I/O requirements.
• Power — Low-voltage operation with a supply range of 2.3 V to 2.7 V to match modern low-voltage systems.
• Package & Mounting — 208-BFQFP surface-mount package; supplier device package listed as 208-PQFP (28×28) for compact PCB integration.
• Reliability & Qualification — Military grade device qualified to MIL-STD-883 and RoHS compliant for regulated environments.
• Extended Temperature Range — Rated for operation from −55 °C to 125 °C to support temperature-extreme deployments.

Typical Applications

• Military and Aerospace Systems — Use in avionics, mission equipment, and other platforms where MIL-STD-883 qualification and extended temperature operation are required.
• Embedded Control and Sensor Interfaces — Implement sensor aggregation, timing control, and protocol handling using the 158 I/Os and 8,192 logic elements.
• Communications and Protocol Bridging — Implement custom protocol logic, framing, and parallel interfacing leveraging on-chip RAM and abundant I/O.
• Fielded Electronic Modules — Deploy in rugged modules that require surface-mount integration and operation across a wide thermal range.

Unique Advantages

• MIL-STD-883 Qualification: Built for applications requiring military-level device qualification to support reliability-driven designs.
• Wide Operating Temperature: −55 °C to 125 °C rating enables deployment in thermally demanding environments.
• High I/O Count: 158 I/Os provide flexibility for interfacing multiple peripherals and parallel signals without external glue logic.
• Compact Surface-Mount Package: 208-BFQFP / 208-PQFP (28×28) reduces PCB footprint while maintaining access to a high pin count.
• Low-Voltage Operation: 2.3 V to 2.7 V supply compatibility for integration with modern low-voltage systems.
• On-Chip Memory: 73,728 bits of embedded RAM support local buffering and small data structures within the FPGA fabric.

Why Choose APA300-PQ208M?

The APA300-PQ208M positions itself as a reliable, qualification-ready FPGA option for designs that need a practical balance of logic capacity, on-chip RAM, and high I/O density while operating over a broad military temperature range. Its MIL-STD-883 qualification and RoHS compliance make it appropriate for regulated and high-reliability applications.

This device is suited to engineers developing mission-critical embedded systems, avionics modules, and fielded electronic equipment that require a compact surface-mount package and proven qualification pedigree from Microchip Technology.

Request a quote or submit an inquiry for APA300-PQ208M to obtain pricing and availability information for your next design.