APA300-PQG208

IC FPGA 158 I/O 208QFP
Part Description

ProASICPLUS Field Programmable Gate Array (FPGA) IC 158 73728 208-BFQFP

Quantity 153 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package208-PQFP (28x28)GradeCommercialOperating Temperature0°C – 70°C
Package / Case208-BFQFPNumber of I/O158Voltage2.3 V - 2.7 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBsN/ANumber of Logic Elements/Cells8192
Number of Gates300000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits73728

Overview of APA300-PQG208 – ProASICPLUS Field Programmable Gate Array (FPGA) IC 158 73728 208-BFQFP

The APA300-PQG208 is a ProASICPLUS field programmable gate array (FPGA) from Microchip Technology designed for commercial-grade applications. It provides a balance of programmable logic capacity, on-chip memory, and a high I/O count in a 208-pin BFQFP surface-mount package.

With defined operating conditions and a compact package footprint, this FPGA suits designs that require configurable digital logic, moderate embedded memory, and extensive external connectivity at standard commercial temperatures.

Key Features

  • Logic Capacity  Approximately 8,192 logic elements (cells) enabling implementation of custom digital functions and moderate-complexity designs.
  • On-Chip Memory  73,728 bits of embedded RAM—approximately 0.074 Mbits—available for data buffering, small lookup tables, and state storage.
  • Gate Count  Around 300,000 gates of combinational/sequential resources to support a range of programmable logic requirements.
  • I/O Resources  158 general-purpose I/Os to support multiple external interfaces, sensors, and peripheral connections.
  • Power  Operates from a 2.3 V to 2.7 V supply range suitable for low-voltage system domains.
  • Package & Mounting  Supplied in a 208-BFQFP package (supplier device package: 208-PQFP, 28×28) for surface-mount PCB assembly.
  • Commercial Operating Range  Rated for 0 °C to 70 °C operation for standard commercial-environment deployments.
  • RoHS Compliant  Manufactured in compliance with RoHS requirements.

Typical Applications

  • Custom Digital Logic Prototyping  Use the programmable logic and logic-element density to prototype and validate digital functions before volume implementation.
  • I/O Expansion and Interface Bridging  Leverage 158 I/Os to implement interface translation, bus bridging, or glue-logic between multiple peripherals and controllers.
  • Embedded Control and State Machines  Deploy the logic elements and on-chip memory to implement control state machines and deterministic embedded control tasks within commercial systems.
  • Signal Conditioning and Data Packing  Use the FPGA’s gates and RAM to perform simple signal formatting, buffering, and data aggregation for downstream processing.

Unique Advantages

  • Balanced Logic and Memory:  8,192 logic elements paired with 73,728 bits of embedded RAM provide an efficient mix for mid-complexity designs without external memory.
  • High I/O Count:  158 I/Os simplify system integration by accommodating multiple peripherals and interfaces directly on-chip, reducing external glue components.
  • Compact Surface-Mount Package:  The 208-BFQFP (208-PQFP, 28×28) package supports dense PCB layouts while remaining compatible with standard surface-mount assembly processes.
  • Low-Voltage Operation:  2.3 V to 2.7 V supply range supports integration with modern low-voltage digital domains.
  • Commercial Temperature Rating:  Specified 0 °C to 70 °C operating range fits a wide range of commercial applications and environments.
  • RoHS Compliance:  Meets RoHS requirements for environmentally conscious manufacturing and supply-chain compliance.

Why Choose APA300-PQG208?

The APA300-PQG208 delivers a practical combination of programmable logic, embedded memory, and abundant I/O in a commercially rated, surface-mount 208-pin BFQFP package. It is positioned for designers who need mid-level logic capacity (approximately 8,192 logic elements) with integrated RAM (73,728 bits) and a high pin count to minimize external components and simplify board-level integration.

Backed by Microchip Technology’s ProASICPLUS family platform attributes, the APA300-PQG208 offers predictable electrical and thermal behavior within its specified 2.3 V–2.7 V supply range and 0 °C–70 °C operating window, providing a solid long-term option for commercial embedded and interfacing designs.

If you would like pricing, lead-time information, or a formal quote for APA300-PQG208, please request a quote or submit a sales inquiry and our team will respond promptly.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1989


    Headquarters: Chandler, Arizona, USA


    Employees: 22,000+


    Revenue: $8.349 Billion


    Certifications and Memberships: ISO9001:2015, IATF16949:2016, AS 9100D


    Featured Products
    Latest News
    keyboard_arrow_up