APA300-PQ208

IC FPGA 158 I/O 208QFP
Part Description

ProASICPLUS Field Programmable Gate Array (FPGA) IC 158 73728 208-BFQFP

Quantity 31 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package208-PQFP (28x28)GradeCommercialOperating Temperature0°C – 70°C
Package / Case208-BFQFPNumber of I/O158Voltage2.3 V - 2.7 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBsN/ANumber of Logic Elements/Cells8192
Number of Gates300000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits73728

Overview of APA300-PQ208 – ProASICPLUS FPGA, 8192 logic elements, 208-BFQFP

The APA300-PQ208 is a ProASICPLUS Field Programmable Gate Array (FPGA) IC from Microchip Technology. It provides 8,192 logic elements (approximately 300,000 gates) and 73,728 bits of on-chip RAM, making it suitable for a range of commercial digital logic functions.

This commercial-grade, surface-mount FPGA is packaged in a 208-BFQFP (supplier device package: 208-PQFP, 28×28) and supports 158 I/O pins. It operates from a 2.3 V to 2.7 V supply and across an ambient temperature range of 0 °C to 70 °C.

Key Features

  • Core Logic  8,192 logic elements providing approximately 300,000 gates for implementing combinational and sequential logic functions.
  • Embedded Memory  73,728 bits of on-chip RAM (approximately 0.074 Mbits) for distributed storage and buffering.
  • I/O Capacity  158 general-purpose I/O pins to support a broad mix of external interfaces and peripheral connections.
  • Package & Mounting  Available in a 208-BFQFP package (supplier package: 208-PQFP, 28×28) designed for surface-mount assembly.
  • Power  Operates from a 2.3 V to 2.7 V supply voltage range suitable for low-voltage system environments.
  • Temperature & Grade  Commercial-grade device rated for 0 °C to 70 °C ambient operation.
  • Environmental Compliance  RoHS compliant for lead-free assembly and regulatory alignment.

Unique Advantages

  • High logic density: 8,192 logic elements and approximately 300,000 gates provide the capacity to implement complex custom logic and glue functions within a single device.
  • On-chip storage: 73,728 bits of embedded RAM support local buffering and small data stores without external memory.
  • Generous I/O count: 158 I/O pins allow direct interfacing to multiple peripherals and system buses, reducing the need for external I/O expanders.
  • Compact surface-mount package: 208-BFQFP (208-PQFP, 28×28) provides a space-efficient footprint for board-level integration.
  • Low-voltage operation: 2.3 V to 2.7 V supply range enables integration into low-voltage designs.
  • Commercial-grade availability: Specified for 0 °C to 70 °C operation to meet standard commercial application requirements.

Why Choose APA300-PQ208?

The APA300-PQ208 positions itself as a compact, commercial-grade FPGA option for embedded designs that require a balance of logic capacity, on-chip memory, and a high I/O count in a surface-mount package. Its combination of 8,192 logic elements, approximately 0.074 Mbits of embedded RAM, and 158 I/O make it well-suited for control, interfacing, and custom digital functions in commercial electronic products.

Backed by Microchip Technology, the APA300-PQ208 provides a defined specification set—package, voltage range, operating temperature, and RoHS compliance—useful for procurement and engineering teams integrating an FPGA with known, verifiable characteristics.

Request a quote or contact sales to inquire about availability and pricing for the APA300-PQ208.

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