APA300-PQ208I

The APA300-PQ208I is a ProASICPLUS field programmable gate array (FPGA) designed for industrial applications that require a mid-density programmable logic device in a compact surface-mount package. It provides a combination of logic capacity, embedded memory and I/O count that suits a range of control and interfacing tasks.

Built with 8,192 logic elements (cells), approximately 73,728 bits of on-chip RAM and 158 I/O, this device targets designs that need programmable logic, significant I/O density and operation across an industrial temperature range with a low-voltage supply between 2.3 V and 2.7 V.

Key Features

• Logic Capacity  Standard device complexity with 300,000 gates and 8,192 logic elements (cells) to implement custom digital functions and glue logic.
• Embedded Memory  On-chip RAM totaling 73,728 bits (approximately 0.074 Mbits) for distributed storage, buffering and state retention within designs.
• I/O Density  158 user I/O pins to support multiple parallel interfaces, sensor connections and peripheral control without external I/O expanders.
• Package & Mounting  Available in a 208-BFQFP surface-mount package (208-PQFP, 28×28 footprint) for PCB designs that require a compact quad-flat form factor.
• Power  Operates from a 2.3 V to 2.7 V supply range to match low-voltage system domains.
• Temperature Range  Industrial-grade operation from −40 °C to 85 °C for reliable performance in temperature-challenging environments.
• RoHS Compliant  Meets RoHS environmental requirements for lead-free assembly and reduced hazardous substances.

Typical Applications

• Industrial Control  Programmable logic for machine control, signal conditioning and I/O aggregation where industrial temperature range and reliability are required.
• Communications Interfaces  Implement protocol glue logic, parallel/serial interfacing and custom transceivers using available I/O and embedded memory.
• Embedded System Integration  Offload custom peripherals, timing logic and state machines from a host processor using on-chip logic and RAM.

Unique Advantages

• Balanced Logic and Memory: 8,192 logic elements paired with 73,728 bits of RAM provide a practical balance for mid-density designs that need both logic and local storage.
• High I/O Count: 158 I/O pins reduce the need for external expansion, simplifying PCB layout and lowering BOM complexity for multi-sensor or multi-interface systems.
• Industrial Ready: Rated for −40 °C to 85 °C operation and offered in a standard surface-mount 208-BFQFP package suitable for industrial embedded assemblies.
• Low-Voltage Operation: 2.3 V to 2.7 V supply compatibility supports integration with modern low-voltage logic domains.
• RoHS Compliance: Supports lead-free manufacturing and environmental compliance requirements for many industrial products.

Why Choose APA300-PQ208I?

The APA300-PQ208I delivers a practical mix of logic density, embedded memory and I/O capacity in a compact 208-BFQFP surface-mount package, making it a solid choice for industrial embedded designs that require configurable digital logic and robust operating temperature performance. Its specifications—8,192 logic elements, 73,728 bits of RAM, 158 I/Os, and a 2.3 V–2.7 V supply range—support a wide range of control, interface and integration tasks without over-specifying resources.

This device is well suited to engineers and procurement teams building mid-density programmable solutions who need predictable electrical and thermal behavior, RoHS compliance and a flexible FPGA resource that can be deployed across multiple product variants for long-term design continuity.

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