APA300-FGG144A

The APA300-FGG144A is a ProASICPLUS field programmable gate array designed for mid-density logic integration with on-chip memory and flexible I/O. It provides 8192 logic elements (cells), approximately 73.7 kbits of embedded RAM, and 100 user I/O in a compact 144-LBGA package.

With a vendor-specified operating range from -40 °C to 125 °C, AEC-Q100 qualification, and a narrow supply window of 2.375–2.625 V, this device targets applications that require predictable electrical behavior, moderate logic capacity and robust temperature performance.

Key Features

• Core Logic  8192 logic element cells supporting up to 300,000 gates for implementing combinational and sequential logic functions.
• Embedded Memory  Approximately 0.074 Mbits (73,728 bits) of on-chip RAM for small buffers, FIFOs or state storage.
• I/O Count  100 user I/O pins suitable for multi-signal interfaces and peripheral connectivity.
• Power and Supply  Single supply voltage range of 2.375 V to 2.625 V for core operation, enabling consistent supply requirements in system designs.
• Package & Mounting  Surface-mount 144-LBGA package (144-FPBGA, 13×13) for space-efficient board layouts.
• Temperature & Qualification  Automotive-grade qualification with AEC-Q100 and an operating temperature range of -40 °C to 125 °C for demanding thermal environments.
• Compliance  RoHS compliant to support environmental and manufacturing regulations.

Typical Applications

• Automotive control systems  AEC-Q100 qualification and extended temperature range make this FPGA suitable for in-vehicle control modules and domain-specific logic.
• Industrial automation  Use the device for sensor interfacing, protocol bridging and control logic where robust temperature performance and moderate logic density are required.
• Communications and interface logic  100 I/O and on-chip RAM support implementation of custom interfaces, data buffering and glue-logic between subsystems.
• Embedded processing and peripherals  8192 logic elements and embedded RAM enable integration of custom state machines, timing control and peripheral handling within a single package.

Unique Advantages

• Automotive-grade reliability: AEC-Q100 qualification combined with -40 °C to 125 °C operation supports deployment in temperature-extreme automotive and harsh-environment applications.
• Balanced logic and memory capacity: 8192 logic elements and approximately 0.074 Mbits of RAM provide a practical mix of resources for mid-range FPGA designs.
• Generous I/O count: 100 user I/Os simplify integration with multiple peripherals and interfaces without external I/O expanders.
• Compact surface-mount package: 144-LBGA (13×13) offers a small PCB footprint for space-constrained systems while preserving connectivity.
• Stable supply window: Tight voltage supply range (2.375–2.625 V) supports predictable electrical behavior and simplifies power sequencing in controlled systems.
• Regulatory compliance: RoHS compliance supports controlled-materials designs and manufacturing processes.

Why Choose APA300-FGG144A?

The APA300-FGG144A positions itself as a reliable mid-density FPGA option for engineers needing a balanced combination of logic, memory and I/O within a compact package. Its AEC-Q100 qualification and extended operating temperature range make it a fit for designs where environmental resilience and longevity are priorities.

This device is well suited to teams developing embedded control, interface logic and moderate-complexity signal processing for automotive and industrial applications. Backed by Microchip Technology manufacturing, it delivers predictable electrical characteristics and form-factor advantages for streamlined board-level integration.

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