APA300-FG256A

The APA300-FG256A is a ProASICPLUS field programmable gate array (FPGA) from Microchip Technology designed for applications requiring mid-range logic capacity, substantial on-chip RAM, and a high I/O count. It combines 8,192 logic elements and approximately 0.0737 Mbits of embedded memory with a 256-LBGA surface-mount package to deliver a compact, qualified solution for demanding electronic systems.

With AEC-Q100 qualification, RoHS compliance, and an extended operating temperature range, this device targets designs where reliability across temperature extremes, high pin count, and compact board footprint are important.

Key Features

• Programmable Logic Capacity — 8,192 logic elements and approximately 300,000 gates provide the fabric to implement custom digital functions, state machines, and glue logic.
• Embedded Memory — Total on-chip RAM of 73,728 bits (approximately 0.0737 Mbits) for FIFO, buffering, and small data storage requirements.
• I/O Resources — 186 general-purpose I/O pins accommodate dense sensor arrays, interface bridging, and multi-channel I/O requirements.
• Power — Operates from a supply range of 2.375 V to 2.625 V, enabling integration with systems using similar core voltages.
• Package & Mounting — 256-LBGA in a 256-FPBGA (17×17) supplier package for high-density surface-mount PCB designs.
• Automotive Qualification & Temperature Range — AEC-Q100 qualification and specified operation from −40 °C to 125 °C for automotive and other temperature-demanding environments.
• Environmental Compliance — RoHS-compliant manufacturing to meet environmental and regulatory requirements.

Typical Applications

• Automotive Electronics — AEC-Q100 qualification and −40 °C to 125 °C operation make this device suitable for control modules and other vehicle electronics that require qualified components.
• I/O-Intensive Interface Hubs — The 186 I/O pins support aggregation of multiple sensors, actuators, or peripheral interfaces in compact systems.
• Custom Control and Logic — With 8,192 logic elements and embedded RAM, implement tailored control algorithms, protocol handlers, and glue logic.
• Space-Constrained PCB Designs — 256-LBGA (17×17) surface-mount packaging enables high-density placement where board real estate is limited.

Unique Advantages

• Qualified for Automotive Use: AEC-Q100 qualification and a wide operating temperature range support deployment in automotive-grade systems.
• High I/O Density: 186 I/Os reduce the need for external expanders and simplify system-level routing for I/O-heavy designs.
• Balanced Logic and Memory: The combination of 8,192 logic elements and 73,728 bits of on-chip RAM supports both control logic and local buffering requirements.
• Compact Surface-Mount Package: 256-LBGA (256-FPBGA, 17×17) enables a small PCB footprint while maintaining ample I/O and routing capability.
• Regulatory and Environmental Compliance: RoHS-compliant construction aligns with environmental standards for modern electronics manufacturing.

Why Choose APA300-FG256A?

The APA300-FG256A positions itself as a reliable, mid-capacity FPGA option from Microchip Technology suitable for designs that need a balance of logic resources, on-chip memory, and a high I/O count in a compact package. Its AEC-Q100 qualification and −40 °C to 125 °C operating range make it appropriate for temperature-demanding and automotive applications where component qualification is required.

Choose this device when your design requires a qualified, surface-mount FPGA offering substantial I/O density and integrated memory resources in a 256-LBGA footprint for space-constrained systems.

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