APA300-FG144I

The APA300-FG144I is a ProASICPLUS field programmable gate array (FPGA) from Microchip Technology. It provides a mid-range programmable logic option with 8,192 logic elements and a defined on-chip memory capacity for embedded designs.

Designed for systems that require up to 100 I/O, operation across an industrial temperature range, and RoHS compliance, this device targets embedded control, I/O expansion and industrial applications where stable supply and package options matter.

Key Features

• Core Logic  Approximately 8,192 logic elements delivering up to 300,000 gates of user logic capacity for mid-range programmable designs.
• Embedded Memory  On-chip RAM totaling 73,728 bits for LUTs, FIFOs or small buffering tasks within the FPGA fabric.
• I/O Count  100 general-purpose I/O pins to support a range of external interfaces and peripheral connections.
• Power  Operates from a 2.3 V to 2.7 V supply range to match common system power domains.
• Package & Mounting  144-ball LBGA package (supplier package 144-FPBGA, 13 × 13 mm) in a surface-mount form factor suitable for compact board layouts.
• Temperature & Grade  Industrial-grade device specified for operation from −40 °C to 85 °C for deployment in temperature-demanding environments.
• Regulatory  RoHS-compliant for environmentally conscious manufacturing and assembly processes.

Typical Applications

• Industrial Control  Use as programmable logic for control, sequencing and I/O consolidation in industrial automation equipment operating across −40 °C to 85 °C.
• Embedded Systems  Integrate core logic and on-chip RAM to implement custom peripherals, glue logic or protocol handling in compact embedded platforms.
• I/O Expansion  Provide additional digital interfaces and buffering for systems that require up to 100 external signals in a single FPGA package.

Unique Advantages

• Balanced Logic Capacity:  Around 8,192 logic elements and 300,000 gates give designers a clear mid-range FPGA resource set for many control and interface tasks.
• On-chip Memory for Local Buffers:  73,728 bits of embedded RAM enable localized data handling without external memory for small FIFOs or state storage.
• Industrial Temperature Support:  Rated from −40 °C to 85 °C for deployment in temperature-variable environments common in industrial applications.
• Compact BGA Package:  144-ball LBGA (13 × 13 mm) supports dense PCB layouts while providing a robust surface-mount solution.
• Wide Supply Window:  2.3 V to 2.7 V operating range simplifies integration with common system power rails.
• RoHS Compliant:  Meets RoHS requirements to support environmentally regulated manufacturing flows.

Why Choose APA300-FG144I?

The APA300-FG144I positions itself as a reliable, industrial-grade ProASICPLUS FPGA option for designers needing mid-range logic capacity, defined embedded memory, and a substantial I/O complement in a compact BGA package. Its operating voltage range and temperature rating make it suitable for embedded and industrial systems where stable operation and compact integration are required.

Ideal for engineers building control, interface or I/O-centric designs, the APA300-FG144I delivers a balanced mix of logic elements, on-chip RAM and package density to simplify board-level integration while supporting RoHS-compliant production.

Request a quote or submit a pricing and availability request to evaluate APA300-FG144I for your next design.