APA300-CQ208M

IC FPGA 158 I/O 208CQFP
Part Description

ProASICPLUS Field Programmable Gate Array (FPGA) IC 158 73728 208-BFCQFP with Tie Bar

Quantity 138 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time40 Weeks
Datasheet

Specifications & Environmental

Device Package208-CQFP (75x75)GradeMilitaryOperating Temperature-55°C – 125°C
Package / Case208-BFCQFP with Tie BarNumber of I/O158Voltage2.3 V - 2.7 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBsN/ANumber of Logic Elements/Cells8192
Number of Gates300000ECCN3A001A2CHTS Code8542.39.0001
QualificationMIL-STD-883Total RAM Bits73728

Overview of APA300-CQ208M – ProASICPLUS Field Programmable Gate Array (FPGA) IC 158 73728 208-BFCQFP with Tie Bar

The APA300-CQ208M is a ProASICPLUS field programmable gate array (FPGA) from Microchip Technology designed for military-grade, high-reliability applications. It provides a balanced combination of programmable logic, on-chip memory, and a high pin count in a 208-BFCQFP package with tie bar.

With 8,192 logic elements, 73,728 bits of embedded RAM, 158 I/O pins and support for a 2.3 V to 2.7 V supply, this device addresses designs that require qualified hardware, robust temperature range and dense I/O connectivity.

Key Features

  • Core & Logic: 8,192 logic elements and approximately 300,000 equivalent gates provide programmable logic resources for custom digital designs.
  • Embedded Memory: 73,728 bits of on-chip RAM for buffering, state storage and small on-chip data structures.
  • I/O Capacity: 158 general-purpose I/O pins to support high-pin-count interfacing and multiple external peripherals.
  • Power Supply: Operates from a 2.3 V to 2.7 V supply, enabling designs within that nominal core-voltage range.
  • Package & Mounting: 208-BFCQFP package with tie bar (supplier package 208-CQFP, 75 × 75 mm); surface-mount mounting for PCB assembly.
  • Reliability & Qualification: Military grade device qualified to MIL-STD-883 for applications requiring documented qualification.
  • Operating Range: Specified for –55 °C to 125 °C operation to meet wide temperature system requirements.
  • Environmental Compliance: RoHS compliant for lead-free process compatibility.

Typical Applications

  • Military & Defense Electronics: Implement custom logic and interfaces in systems that require MIL-STD-883 qualification and wide operating temperature support.
  • High-Reliability Embedded Control: Control functions and deterministic logic for embedded platforms operating across extreme temperature ranges.
  • I/O-Intensive Interfaces: Bridge, protocol conversion and multi-peripheral interfaces that benefit from a high count of general-purpose I/O pins.
  • On-Board Data Buffering: Small embedded memory can be used for buffering and state storage in compact logic designs.

Unique Advantages

  • Military Qualification: MIL-STD-883 qualification provides documented assurance for high-reliability defense applications.
  • Wide Temperature Rating: –55 °C to 125 °C operating range supports deployments in harsh thermal environments.
  • High I/O Density: 158 I/O pins enable complex interfacing without external expanders, simplifying board-level design.
  • Balanced Logic & Memory: 8,192 logic elements paired with 73,728 bits of RAM deliver a practical mix of programmable capacity and on-chip storage for many embedded tasks.
  • Surface-Mount Packaging: 208-BFCQFP with tie bar in a 75 × 75 supply package supports standard PCB assembly flows for medium-pin-count FPGAs.
  • Regulatory Compliance: RoHS compliance supports lead-free manufacturing requirements.

Why Choose APA300-CQ208M?

The APA300-CQ208M is positioned for engineers and procurement teams who need a military-grade FPGA with a practical balance of logic capacity, embedded memory and a high number of I/Os. Its MIL-STD-883 qualification and wide operating temperature range make it suited to systems where documented qualification and thermal resilience are required.

Backed by Microchip Technology manufacturing, this device provides a selectable combination of programmable resources and package-level integration for long-lived, high-reliability designs that demand stable supply-voltage operation and dense connectivity.

Request a quote or submit an inquiry to receive pricing and availability information for the APA300-CQ208M.

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