APA300-CQ208M
| Part Description |
ProASICPLUS Field Programmable Gate Array (FPGA) IC 158 73728 208-BFCQFP with Tie Bar |
|---|---|
| Quantity | 138 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 40 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 208-CQFP (75x75) | Grade | Military | Operating Temperature | -55°C – 125°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 208-BFCQFP with Tie Bar | Number of I/O | 158 | Voltage | 2.3 V - 2.7 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | N/A | Number of Logic Elements/Cells | 8192 | ||
| Number of Gates | 300000 | ECCN | 3A001A2C | HTS Code | 8542.39.0001 | ||
| Qualification | MIL-STD-883 | Total RAM Bits | 73728 |
Overview of APA300-CQ208M – ProASICPLUS Field Programmable Gate Array (FPGA) IC 158 73728 208-BFCQFP with Tie Bar
The APA300-CQ208M is a ProASICPLUS field programmable gate array (FPGA) from Microchip Technology designed for military-grade, high-reliability applications. It provides a balanced combination of programmable logic, on-chip memory, and a high pin count in a 208-BFCQFP package with tie bar.
With 8,192 logic elements, 73,728 bits of embedded RAM, 158 I/O pins and support for a 2.3 V to 2.7 V supply, this device addresses designs that require qualified hardware, robust temperature range and dense I/O connectivity.
Key Features
- Core & Logic: 8,192 logic elements and approximately 300,000 equivalent gates provide programmable logic resources for custom digital designs.
- Embedded Memory: 73,728 bits of on-chip RAM for buffering, state storage and small on-chip data structures.
- I/O Capacity: 158 general-purpose I/O pins to support high-pin-count interfacing and multiple external peripherals.
- Power Supply: Operates from a 2.3 V to 2.7 V supply, enabling designs within that nominal core-voltage range.
- Package & Mounting: 208-BFCQFP package with tie bar (supplier package 208-CQFP, 75 × 75 mm); surface-mount mounting for PCB assembly.
- Reliability & Qualification: Military grade device qualified to MIL-STD-883 for applications requiring documented qualification.
- Operating Range: Specified for –55 °C to 125 °C operation to meet wide temperature system requirements.
- Environmental Compliance: RoHS compliant for lead-free process compatibility.
Typical Applications
- Military & Defense Electronics: Implement custom logic and interfaces in systems that require MIL-STD-883 qualification and wide operating temperature support.
- High-Reliability Embedded Control: Control functions and deterministic logic for embedded platforms operating across extreme temperature ranges.
- I/O-Intensive Interfaces: Bridge, protocol conversion and multi-peripheral interfaces that benefit from a high count of general-purpose I/O pins.
- On-Board Data Buffering: Small embedded memory can be used for buffering and state storage in compact logic designs.
Unique Advantages
- Military Qualification: MIL-STD-883 qualification provides documented assurance for high-reliability defense applications.
- Wide Temperature Rating: –55 °C to 125 °C operating range supports deployments in harsh thermal environments.
- High I/O Density: 158 I/O pins enable complex interfacing without external expanders, simplifying board-level design.
- Balanced Logic & Memory: 8,192 logic elements paired with 73,728 bits of RAM deliver a practical mix of programmable capacity and on-chip storage for many embedded tasks.
- Surface-Mount Packaging: 208-BFCQFP with tie bar in a 75 × 75 supply package supports standard PCB assembly flows for medium-pin-count FPGAs.
- Regulatory Compliance: RoHS compliance supports lead-free manufacturing requirements.
Why Choose APA300-CQ208M?
The APA300-CQ208M is positioned for engineers and procurement teams who need a military-grade FPGA with a practical balance of logic capacity, embedded memory and a high number of I/Os. Its MIL-STD-883 qualification and wide operating temperature range make it suited to systems where documented qualification and thermal resilience are required.
Backed by Microchip Technology manufacturing, this device provides a selectable combination of programmable resources and package-level integration for long-lived, high-reliability designs that demand stable supply-voltage operation and dense connectivity.
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