APA300-BGG456

The APA300-BGG456 is a ProASICPLUS Field Programmable Gate Array (FPGA) IC from Microchip Technology. It provides a mid-density programmable logic device with a balance of logic resources, on-chip memory and a high I/O count for compact system integration.

Designed for commercial-grade applications, the device combines 8192 logic elements (cells), approximately 0.074 Mbits of embedded RAM (73,728 bits) and up to 290 I/O in a 456-ball BGA package, operating from a 2.3 V to 2.7 V supply and rated for 0 °C to 70 °C.

Key Features

• Logic Capacity  Approximately 300,000 gates and 8,192 logic elements (cells) provide mid-density programmable logic for control, glue-logic and custom datapath implementations.
• On-chip Memory  Approximately 73,728 bits of embedded RAM (≈0.074 Mbits) for local buffering, state storage and small lookup tables.
• High I/O Count  Up to 290 programmable I/O pins support complex interfacing and multiple peripheral connections in a single device.
• Package and Mounting  456-ball BGA package (supplier device package: 456-PBGA, 35 × 35) optimized for surface-mount PCB assembly and dense board layouts.
• Power  Nominal operating supply range of 2.3 V to 2.7 V to match common system rails.
• Commercial Temperature Grade  Rated for 0 °C to 70 °C, suitable for standard commercial applications.
• RoHS Compliant  Device meets RoHS environmental requirements.

Typical Applications

• High-I/O Interfacing  Use when designs require up to 290 I/O for connecting multiple sensors, peripherals or parallel interfaces.
• Mid‑density Logic Integration  Deploy for systems needing roughly 8,192 logic elements to consolidate glue logic and custom control functions onto one device.
• On‑chip Buffering and State Storage  Leverage the embedded 73,728 bits of RAM for small data buffers, FIFOs or lookup tables within tight footprint constraints.

Unique Advantages

• High I/O in a compact package: 290 I/O pins in a 456-BBGA package reduce the need for external I/O expanders and simplify board routing.
• Balanced logic and memory resources: The combination of ~300k gates, 8,192 logic elements and 73,728 bits of RAM supports mixed control and data-path tasks without additional devices.
• Surface-mount, compact form factor: 456-ball BGA (35 × 35) enables dense PCB implementations for space-constrained applications.
• Commercial-grade operating range: 0 °C to 70 °C rating aligns with standard commercial deployments and typical indoor electronics environments.
• Low-voltage operation: 2.3 V to 2.7 V supply compatibility facilitates integration with common low-voltage system rails.
• RoHS compliance: Simplifies regulatory considerations for environmental compliance.

Why Choose APA300-BGG456?

The APA300-BGG456 is positioned for designers who need a mid-density FPGA offering a strong balance of logic elements, embedded memory and a very high I/O count in a single, surface-mount 456-BBGA package. Its supply range and commercial temperature rating make it suitable for standard embedded and electronic equipment designs where consolidation of logic and I/O reduces board count and simplifies integration.

For projects that require moderate gate counts, ample programmable I/O and on-chip RAM in a compact form factor, the APA300-BGG456 delivers a practical combination of resources and package density while meeting RoHS requirements.

Request a quote or submit a purchase inquiry today to evaluate the APA300-BGG456 for your next mid-density FPGA design.