APA300-BG456

The APA300-BG456 is a ProASICPLUS field programmable gate array (FPGA) packaged in a 456-ball BGA for surface-mount assembly. It integrates 8,192 logic elements and approximately 73,728 bits of on-chip RAM to implement custom digital logic with up to 290 user I/O pins. The device targets commercial-grade applications that require flexible I/O, on-chip memory, and moderate gate density in a compact 35 × 35 mm PBGA footprint.

Key Features

• Core Logic  8,192 logic elements providing a platform for custom digital functions and logic acceleration.
• Embedded Memory  Approximately 73,728 bits (~0.074 Mbits) of on-chip RAM for data buffering, FIFOs, and small memory structures.
• I/O Density  Up to 290 user I/O pins to support wide bus interfaces, parallel peripherals, and mixed-signal control boundaries.
• Gate Capacity  Approximately 300,000 gates to accommodate complex combinational and sequential logic implementations.
• Power  Single supply operation from 2.3 V to 2.7 V for core power domains.
• Package & Mounting  456-BBGA (supplier device package: 456-PBGA, 35 × 35 mm) designed for surface-mount PCB assembly and high-density board layouts.
• Operating Range & Grade  Commercial grade operation with an ambient temperature range of 0 °C to 70 °C.
• Environmental Compliance  RoHS compliant to meet standard lead-free assembly requirements.

Typical Applications

• Custom Logic Acceleration  Implement application-specific datapaths and control logic where 8,192 logic elements and ~300k gates help offload processing from a host MCU or CPU.
• I/O-Intensive Control  Use the device's 290 I/O pins for parallel interfaces, multi-channel sensor aggregation, or complex control signal routing.
• On-Chip Buffering & Storage  Leverage the approximately 73,728 bits of embedded RAM for buffering, FIFOs, and small lookup tables within embedded designs.

Unique Advantages

• Balanced Logic and Memory  Combines 8,192 logic elements with on-chip RAM to implement both control logic and local data storage without external memory for many functions.
• High I/O Count  Up to 290 I/O pins enable broad peripheral connectivity and parallel data paths, simplifying board-level routing for complex systems.
• Compact BGA Footprint  456-BBGA / 456-PBGA (35 × 35 mm) package offers a high-density solution that conserves PCB real estate while supporting surface-mount assembly.
• Commercial Temperature Suitability  Rated for 0 °C to 70 °C operation to fit standard commercial electronics environments.
• RoHS Compliance  Meets common environmental assembly requirements for lead-free production.

Why Choose APA300-BG456?

The APA300-BG456 provides a practical balance of logic capacity, embedded memory, and high I/O count in a single commercial-grade FPGA package. Its combination of 8,192 logic elements, approximately 73,728 bits of on-chip RAM, and up to 290 I/O pins makes it well suited to designs that need moderate gate density, local buffering, and extensive peripheral interfacing within a compact 456-ball BGA footprint.

Engineers designing commercial embedded systems, interface controllers, or custom digital accelerators will find the APA300-BG456 valuable for reducing external component count and consolidating functions into a single programmable device, while meeting standard RoHS assembly and commercial temperature requirements.

Request a quote or submit a sales inquiry to learn more about availability, pricing, and lead times for the APA300-BG456.