APA300-BGG456I

The APA300-BGG456I is a ProASICPLUS field programmable gate array (FPGA) IC from Microchip Technology. It provides a mid-range, industrial-grade programmable logic solution with 8,192 logic elements and approximately 73,728 bits of on-chip RAM for implementing custom digital functions.

Designed for industrial embedded applications, the device combines substantial I/O density with a compact 456-BBGA package and broad environmental tolerance to support systems requiring robust, reconfigurable logic.

Key Features

• Core Logic  8,192 logic elements and 300,000 gates enable implementation of custom combinational and sequential logic functions.
• Embedded Memory  Approximately 0.074 Mbits (73,728 bits) of on-chip RAM for buffering, FIFOs, and small data stores.
• I/O Capacity  Up to 290 I/O pins to support high-channel-count interfacing and parallel connectivity needs.
• Power  Operates from a 2.3 V to 2.7 V supply range to match system power domains.
• Package & Mounting  456-BBGA package (supplier device package: 456-PBGA, 35×35) in a surface-mount form factor for compact PCB integration.
• Industrial Temperature Range  Rated for operation from –40°C to 85°C to meet industrial-environment requirements.
• Compliance  RoHS compliant to support regulatory-driven design requirements.

Typical Applications

• Industrial Control  Industrial embedded systems requiring a configurable logic device with industrial temperature range and robust I/O capacity.
• Custom Digital Logic  Implement custom state machines, protocol translators, or glue logic using 8,192 logic elements and ~300,000 gates.
• I/O-Intensive Systems  Designs that demand high pin count and parallel interfacing can leverage up to 290 I/O lines in the 456-BBGA package.

Unique Advantages

• High I/O Density: Supports up to 290 I/O pins to accommodate complex interfacing and multi-channel requirements.
• Balanced Logic and Memory: 8,192 logic elements together with approximately 0.074 Mbits of embedded RAM provide a practical balance for control, buffering, and small data storage.
• Industrial Qualification: Rated for –40°C to 85°C operation, suitable for deployments in demanding environments.
• Compact BBGA Package: 456-BBGA (456-PBGA, 35×35) surface-mount package enables dense PCB layouts while maintaining a large I/O count.
• Narrow Supply Range: 2.3 V to 2.7 V supply simplifies power-domain planning in modern embedded systems.
• Regulatory Compliance: RoHS compliance supports environmentally conscious product design and manufacturing.

Why Choose APA300-BGG456I?

The APA300-BGG456I positions itself as a reliable, industrial-grade FPGA option for engineers who need a compact, high-I/O programmable device with a clear balance of logic resources and on-chip memory. Its specification profile—8,192 logic elements, ~73.7k bits of RAM, 290 I/O, and operation across –40°C to 85°C—makes it well suited to embedded designs that require reconfigurable logic in challenging environments.

Backed by Microchip Technology and provided in a 456-BBGA surface-mount package, the APA300-BGG456I offers a practical solution for applications that demand configurable hardware, robust operating range, and RoHS-compliant manufacturing readiness.

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