APA300-BG456I

The APA300-BG456I is a ProASICPLUS field programmable gate array (FPGA) IC offering a balance of programmable logic capacity and a high I/O count in a compact 456-ball BGA package. It provides 300,000 gates and 8,192 logic elements, along with on-chip RAM and broad I/O support for complex programmable logic integration.

Specified for industrial-grade applications, the device operates from a 2.3 V to 2.7 V supply and across an operating temperature range of −40 °C to 85 °C. The surface-mount 456-PBGA (35×35) package and RoHS compliance support modern manufacturing and environmental requirements.

Key Features

• Core Logic 300,000 gates and 8,192 logic elements provide the programmable resources needed for mid-density logic designs and custom hardware acceleration.
• Embedded Memory 73,728 bits of on-chip RAM to support buffering, small embedded data structures, and temporary storage for logic functions.
• I/O Capacity 290 available I/O pins to accommodate multiple external interfaces, sensors, and peripheral connections in a single device.
• Package & Mounting 456-ball BGA (supplier device package: 456-PBGA, 35×35) in a surface-mount footprint for high pin-count board designs in compact area.
• Power Single supply operation from 2.3 V to 2.7 V to match common low-voltage system rails.
• Environmental & Reliability Industrial-grade temperature rating from −40 °C to 85 °C and RoHS compliance for regulatory and long-term deployment considerations.

Typical Applications

• Industrial Control Systems Implement custom control logic, interface aggregation, and real-time processing in industrial automation equipment within the device’s industrial temperature range.
• Communications and Networking Use the high I/O count and programmable logic capacity for protocol bridging, packet processing, or peripheral aggregation in communications modules.
• Embedded System Integration Consolidate multiple glue-logic functions and interface conversion into a single FPGA to reduce component count and simplify board layout.

Unique Advantages

• High Logic Capacity: 300,000 gates and 8,192 logic elements enable implementation of substantial custom logic and mid-sized accelerators.
• Extensive I/O: 290 I/O pins support multiple external interfaces and sensors without the need for external multiplexing.
• Compact, High-Pin Package: 456-ball BGA (35×35) provides high connectivity in a compact footprint suitable for dense board designs.
• Industrial Temperature Support: Rated from −40 °C to 85 °C for deployment in temperature-demanding environments.
• Low-Voltage Compatibility: 2.3 V to 2.7 V supply range aligns with common low-voltage system rails for modern embedded platforms.
• Regulatory Compliance: RoHS-compliant construction to meet environmental and manufacturing standards.

Why Choose APA300-BG456I?

The APA300-BG456I positions itself as a mid-density ProASICPLUS FPGA option for designers who need a combination of substantial programmable logic, extensive I/O, and industrial operating capability. Its 8,192 logic elements and 300,000 gates make it suitable for consolidating multiple functions into a single device while the 290 I/Os enable broad external connectivity.

Engineers targeting industrial applications benefit from the device’s −40 °C to 85 °C rating, compact 456-BBGA packaging, and RoHS compliance. The voltage supply range and surface-mount package support integration into contemporary embedded and industrial boards, offering a robust platform for scalable, long-life hardware designs.

Request a quote or submit a pricing inquiry to check availability and obtain procurement details for the APA300-BG456I.