APA150-TQG100A

The APA150-TQG100A is a ProASICPLUS field programmable gate array (FPGA) in a 100-LQFP package, delivering a balanced mix of programmable logic, on-chip RAM and I/O capability. It provides 6,144 logic elements, approximately 36,864 bits of embedded RAM and a gate equivalent of 150,000 to address moderate-density programmable logic requirements.

Designed and qualified for automotive environments (AEC‑Q100), the device supports operation from -40 °C to 125 °C and a nominal supply range of 2.375 V to 2.625 V. Its surface-mount 100-pin package and 66 available I/O pins make it suitable for applications that require compact, qualified programmable logic with defined on-chip resources.

Key Features

• Core Logic 6,144 logic elements providing programmable logic resources with an equivalent of 150,000 gates for implementing customized digital functions.
• On-Chip Memory Approximately 36,864 bits of embedded RAM to store state, buffers or small data structures directly on-chip.
• I/O Capacity 66 user-accessible I/O pins to implement parallel interfaces, custom signaling and peripheral connectivity within the package constraints.
• Package and Mounting 100-LQFP surface-mount package (supplier device package: 100-TQFP, 14×14 mm) for compact PCB integration.
• Power Nominal supply voltage range of 2.375 V to 2.625 V to match low-voltage system domains.
• Automotive Qualification AEC‑Q100 qualification and automotive grade classification for deployments that require that level of component qualification.
• Operating Range Rated for operation from -40 °C to 125 °C to support wide-temperature use cases.
• Regulatory Compliance RoHS compliant for environmental and assembly considerations.

Typical Applications

• Automotive Electronics Suitable for automotive systems that require AEC‑Q100 qualified programmable logic and a wide operating temperature range.
• Control and Interface Logic Use the available logic elements and on-chip RAM to implement custom control functions, protocol bridging or interface glue logic within constrained board space.
• Custom I/O Implementations Leverage 66 I/O pins to create tailored peripheral interfaces and I/O expansion in compact electronic modules.

Unique Advantages

• Automotive-Grade Qualification: AEC‑Q100 qualification and automotive grade classification provide confidence for vehicle electronics and other demanding thermal environments.
• Balanced Logic and Memory: 6,144 logic elements paired with approximately 36,864 bits of embedded RAM allow implementation of medium-complexity logic and modest data buffering on-chip.
• Defined I/O Count: 66 I/O pins give designers predictable interface capacity for sensors, actuators and peripherals without overprovisioning package size.
• Compact Surface-Mount Package: 100-LQFP (100-TQFP, 14×14 mm) supports dense PCB layouts while keeping part count and board area controlled.
• Wide Operating Temperature: Rated from -40 °C to 125 °C to meet thermal demands common to automotive and rugged embedded applications.
• Low-Voltage Operation: Operates within a 2.375 V to 2.625 V supply window for compatibility with low-voltage system domains.

Why Choose APA150-TQG100A?

The APA150-TQG100A combines a moderate logic element count, on-chip memory and a defined I/O footprint in a compact 100‑pin surface-mount package, making it a practical choice for designs that need qualified programmable logic without excessive package size. Its AEC‑Q100 qualification and wide operating temperature range make it appropriate for automotive and other thermally demanding applications that require verified component robustness.

This device is suited to engineers and procurement teams seeking a field-programmable solution with clear, verifiable resources—logic elements, RAM, I/O count, package and electrical/temperature ratings—so they can plan PCB integration and thermal design with confidence.

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