APA300-BG456M

The APA300-BG456M is a ProASICPLUS field programmable gate array (FPGA) IC from Microchip Technology. It provides a balanced combination of logic resources, embedded RAM, and a high I/O count in a compact 456-ball BGA package targeted at military-grade embedded systems.

With MIL-STD-883 qualification, an extended operating temperature range, and a low-voltage supply window, this device is suited for designs that require dependable operation in demanding environments while offering flexible logic and interfacing capability.

Key Features

• Logic Resources  Provides 300,000 gates and 8,192 logic elements, enabling mid-density programmable logic for control, glue-logic, and custom processing functions.
• Embedded Memory  Includes 73,728 bits of on-chip RAM (approximately 0.074 Mbits) for buffering, small data structures, and state storage.
• I/O and Package  Offers 290 user I/O pins in a 456-BBGA footprint (supplier package: 456-PBGA, 35×35), supporting high-density signal routing in a surface-mount form factor.
• Power  Operates from a 2.3 V to 2.7 V supply range to match low-voltage system domains.
• Qualification & Reliability  Military grade with MIL-STD-883 qualification for use in applications that require verified microelectronic performance and traceable qualification.
• Environmental Range  Designed for operation from −55 °C to 125 °C to support temperature extremes encountered in defense and rugged embedded platforms.
• Mounting & Compliance  Surface-mount device with RoHS compliance for lead-free assembly environments.

Typical Applications

• Military and Defense Systems  Deterministic programmable logic and MIL-STD-883 qualification make the APA300-BG456M suitable for rugged mission electronics and subsystem control.
• Rugged Embedded Control  Wide temperature range and high I/O count support control and interfacing tasks in harsh-environment embedded controllers.
• High-Density I/O Signal Processing  Large number of I/O pins and moderate on-chip RAM enable aggregation, preprocessing, and glue logic for data acquisition and sensor interfaces.
• Compact Board-Level Integration  456-BBGA package delivers substantial logic and I/O capability in a compact surface-mount footprint for space-constrained designs.

Unique Advantages

• Military-Grade Qualification:  MIL-STD-883 qualification and a −55 °C to 125 °C operating range provide traceable performance characteristics for defense and rugged applications.
• High I/O Count:  290 I/O pins simplify external interfacing, reducing the need for additional IO expanders and minimizing system bill of materials.
• Balanced Logic and Memory:  8,192 logic elements and 73,728 bits of RAM support a range of mid-complexity logic functions while keeping board-level integration straightforward.
• Compact, Surface-Mount Package:  456-BBGA (35×35) package permits dense integration on modern PCBs while maintaining a high pin count.
• Low-Voltage Operation:  2.3–2.7 V supply range aids compatibility with low-voltage system domains and helps simplify power-supply design.
• RoHS Compliant:  Lead-free assembly compatibility supports modern manufacturing processes and environmental requirements.

Why Choose APA300-BG456M?

The APA300-BG456M is positioned for engineers who need military-qualified programmable logic with a high I/O density and a balance of logic and embedded memory resources. Its combination of 8,192 logic elements, 300,000 gates, and 290 I/O in a compact 456-BBGA package makes it suitable for rugged embedded designs where reliable operation across a wide temperature range is required.

For projects requiring traceable qualification, a small footprint, and the ability to consolidate interface and control functions into a single device, the APA300-BG456M delivers a practical, verifiable building block backed by Microchip Technology's ProASICPLUS product heritage.

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