APA300-CQ208B

IC FPGA 158 I/O 208CQFP
Part Description

ProASICPLUS Field Programmable Gate Array (FPGA) IC 158 73728 208-BFCQFP with Tie Bar

Quantity 534 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time40 Weeks
Datasheet

Specifications & Environmental

Device Package208-CQFP (75x75)GradeMilitaryOperating Temperature-55°C – 125°C
Package / Case208-BFCQFP with Tie BarNumber of I/O158Voltage2.3 V - 2.7 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBsN/ANumber of Logic Elements/Cells8192
Number of Gates300000ECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits73728

Overview of APA300-CQ208B – ProASICPLUS Field Programmable Gate Array (FPGA) IC

The APA300-CQ208B is a ProASICPLUS field programmable gate array (FPGA) IC from Microchip Technology, designed for applications requiring military-grade environmental performance. It consolidates logic, on-chip RAM, and a high count of I/O in a 208-pin BFCQFP package with tie bar.

With 8,192 logic elements and 300,000 gates, the device targets embedded systems and rugged electronics where a 158-pin I/O footprint, a 2.3 V–2.7 V supply window, and an extended operating range of –55 °C to 125 °C are required.

Key Features

  • Core Logic  8,192 logic elements and approximately 300,000 gates provide the programmable fabric for custom digital functions.
  • Embedded Memory  Approximately 0.074 Mbits (73,728 bits) of on-chip RAM for buffering, state storage, and small lookup tables.
  • I/O Density  158 user I/O pins support complex interfacing and multiple peripheral connections in a single device.
  • Power Domain  Single supply operation from 2.3 V to 2.7 V to match systems using similar core/bus voltages.
  • Package and Mounting  208-BFCQFP with tie bar (supplier package: 208-CQFP, 75 × 75) in a surface-mount form factor for board-level assembly.
  • Environmental and Grade  Military-grade device rated for an operating temperature range of –55 °C to 125 °C and RoHS compliance for environmental conformance.

Typical Applications

  • Military and Defense Systems  Use in rugged avionics, communications, and control electronics where military-grade temperature range and reliability are required.
  • Embedded Control  Implement custom control logic and state machines using the 8,192 logic elements and on-chip RAM for real-time operations.
  • High-Density I/O Interfaces  Leverage 158 I/O pins for sensor aggregation, actuator control, and multi-channel peripheral interfacing.
  • Ruggedized Electronics  Deploy in applications that demand surface-mount packaging and extended temperature operation for reliability in harsh environments.

Unique Advantages

  • Military-Grade Operating Range:  Rated from –55 °C to 125 °C, the APA300-CQ208B supports designs that must operate across extreme temperature environments.
  • High Logic Capacity:  8,192 logic elements and ~300,000 gates provide substantial programmable resources for complex digital designs.
  • Compact, High-Pin Count Package:  The 208-BFCQFP (208-CQFP, 75 × 75) package offers a high I/O count in a surface-mount form factor to reduce board-level routing complexity.
  • Wide Compatibility with Low-Voltage Systems:  2.3 V to 2.7 V supply range enables integration with low-voltage cores and peripherals.
  • On-Board Memory:  73,728 bits of embedded RAM provide local storage for buffers and small data structures without external memory.
  • Regulatory Compliance:  RoHS-compliant construction supports environmentally conscious manufacturing and deployment.

Why Choose APA300-CQ208B?

The APA300-CQ208B combines a substantial logic element count, dedicated on-chip RAM, and a high I/O complement in a rugged, military-grade package—making it a fit for embedded designs that require deterministic digital implementation under extreme environmental conditions. Its 2.3 V–2.7 V supply range and surface-mount 208-pin CQFP packaging simplify integration into systems constrained by board space and low-voltage power rails.

Produced by Microchip Technology as part of the ProASICPLUS family, this FPGA is aimed at engineers and procurement teams specifying devices for defense, aerospace, and other applications where temperature resilience, I/O density, and on-chip resources are key selection criteria.

Request a quote or submit a pricing inquiry to receive availability and lead-time information for the APA300-CQ208B.

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