APA300-BGG456M

The APA300-BGG456M is a ProASICPLUS field programmable gate array (FPGA) from Microchip Technology designed for high-reliability, military-grade applications. It combines a substantial logic capacity with on-chip RAM and a high I/O count in a 456-ball BGA package.

With MIL-STD-883 qualification and an extended operating temperature range, this device is targeted at defense, aerospace, and other environments that require rugged, long-lifecycle programmable logic with precise voltage and temperature specifications.

Key Features

• Core Logic — 8,192 logic elements providing the programmable fabric for custom digital functions and 300,000 equivalent gates for complex designs.
• Embedded Memory — 73,728 bits of on-chip RAM to support buffering, state storage, and small lookup-tables within the FPGA fabric.
• I/O Capability — 290 user I/O pins to support dense external device interfacing and high-pin-count systems integration.
• Package and Mounting — 456-ball BGA (supplier device package: 456-PBGA, 35×35) in a surface-mount form factor for compact board layouts.
• Power — Operates from a 2.3 V to 2.7 V supply, enabling use in systems with lower core voltage rails.
• Reliability and Qualification — Military grade with MIL-STD-883 qualification for applications requiring established testability and rugged performance.
• Temperature Range — Rated for operation from −55 °C to 125 °C to meet demanding environmental requirements.
• Compliance — RoHS compliant for materials and manufacturing processes.

Typical Applications

• Defense & Aerospace Systems — Military-grade qualification and extended temperature operation make this FPGA suitable for mission-critical avionics, radars, and tactical electronics.
• High-Reliability Embedded Control — Dense I/O and on-chip RAM support real-time control and state machines in rugged embedded platforms.
• Communications Equipment — The combination of logic resources and numerous I/Os enables custom protocol handling and front-end interfacing for communications subsystems.
• Industrial Instrumentation — Extended temperature range and MIL-STD testing provide robustness for precision measurement and control equipment in harsh environments.

Unique Advantages

• Military-Grade Qualification: MIL-STD-883 qualification ensures the device meets stringent test standards required for defense and aerospace deployments.
• Broad Operating Temperature: −55 °C to 125 °C rating supports designs that must operate reliably in extreme thermal conditions.
• High I/O Density: 290 I/O pins facilitate complex external interfacing and reduce the need for additional I/O expansion components.
• Compact Ball Grid Package: 456-BBGA (35×35) delivers a high-pin-count solution in a space-efficient surface-mount package for dense PCBs.
• Integrated Memory: 73,728 bits of on-chip RAM allow localized buffering and fast-access storage close to logic elements.
• Controlled Supply Range: 2.3 V to 2.7 V operation aligns with common low-voltage system rails for simpler power architecture.

Why Choose APA300-BGG456M?

The APA300-BGG456M positions itself as a reliable, military-grade FPGA option for designers who require verified qualification, extended temperature performance, and a strong combination of logic, memory, and I/O resources. Its 8,192 logic elements, 73,728 bits of embedded RAM, and 290 I/Os provide a balanced platform for implementing custom digital functions in rugged systems.

This device is well suited for teams developing defense, aerospace, and high-reliability embedded products where long-term availability, precise operating voltage, and MIL-STD-883 testing are essential to system qualification and lifecycle planning.

Request a quote or submit an inquiry to receive pricing, availability, and additional procurement details for the APA300-BGG456M.