APA300-FG256I

The APA300-FG256I is a ProASICPLUS field programmable gate array (FPGA) IC from Microchip Technology, delivered in a 256-LBGA package. It combines a mid-range logic capacity with on-chip RAM and a large I/O count, designed for industrial-grade embedded and control applications that require reconfigurable logic in a compact surface-mount package.

With 8,192 logic elements, approximately 0.074 Mbits of embedded memory, and 186 I/O pins, this device targets applications that need moderate logic density, flexible interfacing, and extended operating temperature support.

Key Features

• Core Logic — 8,192 logic elements providing 300,000 gates of combinational and sequential logic capacity for reconfigurable system functions.
• Embedded Memory — 73,728 bits of on-chip RAM (approximately 0.074 Mbits) for local buffering, state machines, and small lookup tables.
• I/O Resources — 186 user I/O pins to support multiple peripheral connections and interface requirements.
• Power — Operates from a 2.3 V to 2.7 V supply range suitable for low-voltage system designs.
• Package & Mounting — 256-LBGA package (supplier device package: 256-FPBGA, 17×17) in a surface-mount form factor for compact PCB layouts.
• Industrial Grade Temperature — Rated for operation from -40 °C to 85 °C to meet wider environmental conditions.
• Regulatory — RoHS compliant.

Typical Applications

• Industrial Control — Implement custom control logic and I/O aggregation in industrial equipment that requires operation across -40 °C to 85 °C.
• Embedded Systems — Add reconfigurable logic and local memory to embedded platforms where moderate gate count and flexible interfacing are needed.
• I/O Expansion — Use the high I/O count to consolidate peripheral interfaces and protocol bridging on a single FPGA device.
• Prototyping and Integration — Rapidly iterate system-level functions and integrate multiple logic blocks in a compact LBGA footprint.

Unique Advantages

• Balanced Logic Density: 8,192 logic elements and 300,000 gates provide a mid-range capacity suitable for diverse digital functions without excessive board area.
• On-chip Memory: 73,728 bits of embedded RAM enables local data buffering and state storage, reducing external memory dependencies.
• Generous I/O Count: 186 I/O pins support complex interfacing and multiple peripheral connections from a single package.
• Low-Voltage Operation: 2.3 V to 2.7 V supply compatibility simplifies integration with low-voltage systems and modern power rails.
• Industrial Temperature Range: Rated -40 °C to 85 °C for deployments in harsher environments where extended temperature support is required.
• Compact Surface-Mount Package: 256-LBGA (256-FPBGA, 17×17) enables high-density PCB designs while maintaining robust mounting.

Why Choose APA300-FG256I?

The APA300-FG256I positions itself as a practical choice for designers who need a mid-range FPGA with a strong mix of logic elements, embedded RAM, and extensive I/O in an industrial-temperature, surface-mount package. Its combination of 8,192 logic elements, 73,728 bits of RAM, and 186 I/Os makes it suitable for embedded control, I/O consolidation, and system integration tasks where space and operating range matter.

Backed by Microchip Technology and provided in a compact 256-LBGA form, this RoHS-compliant device offers a balance of integration and environmental robustness that supports long-term deployment in industrial and embedded applications.

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