APA450-BGG456

The APA450-BGG456 is a ProASICPLUS FPGA from Microchip Technology providing a balanced combination of logic capacity, on-chip memory, and I/O density in a surface-mount ball grid array package. It targets designs that require substantial programmable logic resources and a large number of external interfaces.

With 12,288 logic elements, approximately 0.11 Mbits of embedded memory, up to 344 I/Os and a 456-ball BGA package, this device is suited for commercial-temperature embedded systems where compact, high-density programmable logic is required.

Key Features

• Logic Capacity  12,288 logic elements and approximately 450,000 gates provide ample resources for medium-complexity logic and control implementations.
• Embedded Memory  Total on-chip RAM of 110,592 bits (approximately 0.11 Mbits) supports local buffering and state storage within user logic.
• I/O Density  Up to 344 user I/Os enable designs with multiple external interfaces, peripherals, and board-level interconnects.
• Package & Mounting  456-ball BGA (supplier package: 456-PBGA, 35×35 mm) in a surface-mount form factor provides a compact footprint for high-density boards.
• Power  Operates from a 2.3 V to 2.7 V supply range to match system power rails and design constraints.
• Temperature & Grade  Commercial-grade device rated for 0°C to 70°C operating temperature.
• Environmental Compliance  RoHS-compliant construction supports environmental regulatory requirements for commercial electronics.

Typical Applications

• High-density I/O systems  Use the 344 I/Os to aggregate and route signals between multiple peripherals, sensors, or external devices on compact boards.
• Moderate-memory data buffering  Approximately 0.11 Mbits of embedded RAM enable local packet buffering, FIFOs, and small lookup tables within user logic.
• Custom digital glue logic  Implement protocol bridging, bus interfacing, and custom timing logic using the device's 12,288 logic elements and gate capacity.

Unique Advantages

• Substantial logic resources: 12,288 logic elements and ~450,000 gates allow integration of complex control and data-path logic without external ASICs.
• High I/O count: 344 I/Os reduce the need for additional interface chips and simplify board-level routing for multi-peripheral systems.
• Compact BGA packaging: The 456-ball PBGA (35×35 mm) package delivers high pin density in a manageable PCB footprint for space-constrained applications.
• Low-voltage operation: 2.3 V–2.7 V supply compatibility aligns with common system power rails for modern digital designs.
• Commercial temperature suitability: Rated 0°C to 70°C for standard commercial deployments and environments.
• RoHS compliant: Meets RoHS requirements for environmentally conscious product development.

Why Choose APA450-BGG456?

The APA450-BGG456 delivers a balanced combination of logic density, embedded memory, and high I/O count in a surface-mount 456-BBGA package from Microchip Technology. Its specifications make it a practical choice for commercial embedded designs that need compact, programmable logic with significant interfacing capability.

Designers and procurement teams can select this device when they require scalable on-chip resources—12,288 logic elements, approximately 0.11 Mbits of RAM, and 344 I/Os—combined with a compact 35×35 mm PBGA footprint and RoHS compliance for commercial applications.

Request a quote or submit an inquiry to receive pricing and availability for the APA450-BGG456 for your next design.