AT40K10LV-3DQC

IC FPGA 161 I/O 208QFP
Part Description

AT40K/KLV Field Programmable Gate Array (FPGA) IC 161 4608 576 208-BFQFP

Quantity 1,448 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package208-PQFP (28x28)GradeCommercialOperating Temperature0°C – 70°C
Package / Case208-BFQFPNumber of I/O161Voltage3 V - 3.6 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs576Number of Logic Elements/Cells576
Number of Gates20000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits4608

Overview of AT40K10LV-3DQC – Field Programmable Gate Array (FPGA) – 208-BFQFP

The AT40K10LV-3DQC is a 3.3 V SRAM-based FPGA from Microchip Technology, offered in a 208-pin BFQFP (28×28) package. It provides a balance of on-chip logic, embedded memory and I/O density for high-performance, reconfigurable logic in commercial-temperature applications.

Built on the AT40K/AT40KLV family architecture, the device targets applications that benefit from fast, flexible on-chip SRAM, multiple global clocks and reconfigurability for algorithm updates or in-system changes.

Key Features

  • Core Logic — Approximately 576 logic elements supporting up to 20,000 gates for mid-range FPGA designs and coprocessor functions.
  • Embedded Memory (FreeRAM) — Approximately 4.6 kbits (4,608 bits) of distributed 10 ns programmable SRAM that can be instantiated as single- or dual-port, synchronous or asynchronous RAM.
  • High-speed Arithmetic — Series-level features include array multipliers and cell-to-cell connections optimized for fast multipliers and DSP-style computations.
  • I/O Capability — 161 I/O pins with 3 V/5 V support noted in the series and programmable output drive, enabling flexible board-level interfacing.
  • Clocking — Series architecture provides up to 8 global clocks with low-skew distribution and programmable edge control for synchronous design management.
  • Reconfigurability — Cache Logic dynamic full/partial reconfigurability and unlimited re-programmability via serial or parallel modes for in-system updates.
  • Package & Mounting — Surface-mount 208-BFQFP (208-PQFP, 28×28) package suitable for standard SMT assembly.
  • Power & Temperature — Supply voltage 3.0 V to 3.6 V and commercial operating temperature range of 0 °C to 70 °C.
  • Standards & Tooling — Series supports PCI-compliant I/Os and integrates with industry-standard design flows and toolchains listed in the series documentation.
  • RoHS Compliant — Device is compliant with RoHS requirements.

Typical Applications

  • DSP and Coprocessing — Implement computation-intensive functions such as FIR filters, FFTs and multipliers where on-chip SRAM and array multiplier support accelerate processing.
  • Multimedia and Video Processing — Use the device’s embedded memory and fast arithmetic capability for tasks like compression/decompression and real-time data manipulation.
  • PCI and High-speed I/O Systems — Leverage the series’ PCI-compliant I/O features and programmable drive strength for board-level interface logic and protocol bridging.
  • Adaptive and Reconfigurable Systems — Benefit from dynamic partial/full reconfigurability for in-field algorithm updates and adaptive designs.

Unique Advantages

  • Flexible On-chip SRAM: Distributed 10 ns FreeRAM enables multiple independent RAM functions without consuming additional logic resources.
  • Reconfigurability In-System: Cache Logic capability and unlimited re-programmability via serial or parallel modes simplify updates and adaptive designs.
  • Balanced Integration: Combined logic, embedded memory and abundant I/O provide a compact solution that reduces external components and BOM complexity.
  • Clocking and Timing Control: Eight global clocks and programmable edge control help implement complex synchronous systems with low-skew distribution.
  • Package Options for SMT: 208-BFQFP surface-mount package supports standard PCB assembly and enables high-density board layouts.

Why Choose AT40K10LV-3DQC?

The AT40K10LV-3DQC delivers a practical balance of logic capacity, embedded SRAM and I/O density in a 3.3 V, commercial-temperature FPGA package. It is well suited for designers who need in-system reconfigurability, fast on-chip memory access and DSP-friendly architecture within a mid-range gate-count device.

Engineers developing protocol interfaces, multimedia processing blocks or adaptive coprocessor functions will find the device’s reprogrammability, global clock resources and integrated RAM helpful for shortening development cycles and simplifying system architecture.

Request a quote or submit an inquiry to receive pricing and availability for AT40K10LV-3DQC and to discuss how this FPGA can fit your next design.

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