AX1000-1FG484M

IC FPGA 317 I/O 484FBGA
Part Description

Axcelerator Field Programmable Gate Array (FPGA) IC 317 165888 484-BGA

Quantity 1,004 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package484-FPBGA (23x23)GradeMilitaryOperating Temperature-55°C – 125°C
Package / Case484-BGANumber of I/O317Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs18144Number of Logic Elements/Cells18144
Number of Gates1000000ECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits165888

Overview of AX1000-1FG484M – Axcelerator Field Programmable Gate Array (FPGA) IC 317 165888 484-BGA

The AX1000-1FG484M is an Axcelerator family antifuse FPGA based on Microchip's AX architecture, offering a single-chip, nonvolatile programmable solution. It combines up to 1,000,000 equivalent system gates with 18,144 logic elements and embedded SRAM/FIFO to support complex, high-performance logic implementations.

Designed for military-grade environments, this device supports a wide operating temperature range (−55 °C to 125 °C) and a core voltage range of 1.425 V to 1.575 V. It is targeted at applications that require deterministic timing, on-chip memory and FIFO capabilities, and flexible high-speed I/O options.

Key Features

  • Logic Capacity: 1,000,000 equivalent system gates and 18,144 logic elements provide the resources needed for large, complex designs.
  • Embedded Memory & FIFOs: Approximately 0.166 Mbits (165,888 bits) of on-chip SRAM with embedded FIFO control logic and variable-aspect RAM blocks for flexible memory organization.
  • High-Speed Performance: Family-level performance indicators include 350+ MHz system performance and 500+ MHz internal performance; includes embedded PLLs with 14–200 MHz input range and frequency synthesis capabilities up to 1 GHz.
  • Flexible, Multi-Standard I/Os: 317 user I/Os with support for mixed-voltage operation (1.5V, 1.8V, 2.5V, 3.3V), bank-selectable I/Os (8 banks per device family), differential LVDS/LVPECL and common single-ended standards.
  • High-Speed Serial Capability: I/Os capable of LVDS operation up to 700 Mb/s for high-throughput interfaces.
  • Programmability & I/O Control: Programmable slew rate and drive strength on outputs, programmable input delay and weak pull-up/pull-down options for signal integrity tuning.
  • Security & Test: FuseLock™ programming technology and IEEE 1149.1 (JTAG) boundary-scan testing for design protection and manufacturing diagnostics.
  • Package & Mounting: 484-ball Fine PBGA (484-FPBGA, 23 × 23) surface-mount package for dense board-level integration.
  • Operating Conditions: Military grade with an operating temperature range of −55 °C to 125 °C and a core supply range of 1.425 V to 1.575 V.

Typical Applications

  • Defense & Aerospace: Military-grade temperature rating and nonvolatile single-chip antifuse architecture make this FPGA suitable for mission-critical embedded systems and ruggedized electronics.
  • High-Speed Data Acquisition: Embedded FIFOs and on-chip SRAM enable efficient buffering and streaming for instrumentation, radar, and high-bandwidth sensor systems.
  • Communications & Networking: High-performance PLLs and LVDS-capable I/Os support high-rate serial interfaces and protocol bridging in communication equipment.
  • Custom Hardware Acceleration: Large logic capacity and deterministic timing are suitable for offloading compute-critical functions and implementing application-specific accelerators.

Unique Advantages

  • Single-Chip Nonvolatile Solution: Antifuse technology provides nonvolatile configuration without external configuration memories, simplifying board design and improving reliability.
  • Deterministic Timing and On-Chip PLLs: Segmentable clocks and embedded PLLs enable controlled timing architectures and frequency synthesis for demanding, timing-sensitive designs.
  • Flexible I/O Standards: Mixed-voltage support and programmable I/O characteristics reduce the need for level-shifters and external buffering, lowering BOM and board complexity.
  • Embedded Memory with FIFO Support: Integrated SRAM blocks and FIFO control logic streamline data buffering and pipeline implementations, minimizing external memory dependencies.
  • Security and Testability: FuseLock™ programming and JTAG boundary-scan support help protect IP and simplify manufacturing test flows.
  • Rugged, High-Temperature Operation: Military-grade temperature range and surface-mount FPBGA packaging support deployment in harsh environments.

Why Choose AX1000-1FG484M?

The AX1000-1FG484M positions itself as a high-capacity, military-grade antifuse FPGA that combines substantial logic resources, embedded memory/FIFO capability, and flexible high-speed I/O in a single nonvolatile device. Its deterministic timing, integrated PLLs, and programmable I/O controls make it suited for systems that require predictable performance and compact system integration.

This device is appropriate for engineering teams building ruggedized communications, defense, and high-performance embedded systems that demand on-chip memory, robust security features, and a broad set of I/O standards. The combination of integration and configurability helps reduce system BOM and simplifies board-level design while supporting demanding environmental requirements.

Request a quote or submit an inquiry to receive pricing, availability, and lead-time information for the AX1000-1FG484M. Our team can provide assistance with ordering and technical questions to help evaluate this FPGA for your design.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1989


    Headquarters: Chandler, Arizona, USA


    Employees: 22,000+


    Revenue: $8.349 Billion


    Certifications and Memberships: ISO9001:2015, IATF16949:2016, AS 9100D


    Featured Products
    Latest News
    keyboard_arrow_up