AX1000-1CQ352M

IC FPGA 198 I/O 352CQFP
Part Description

Axcelerator Field Programmable Gate Array (FPGA) IC 198 165888 352-BFCQFP with Tie Bar

Quantity 1,446 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time44 Weeks
Datasheet

Specifications & Environmental

Device Package352-CQFP (75x75)GradeMilitaryOperating Temperature-55°C – 125°C
Package / Case352-BFCQFP with Tie BarNumber of I/O198Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs18144Number of Logic Elements/Cells18144
Number of Gates1000000ECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits165888

Overview of AX1000-1CQ352M – Axcelerator FPGA, 1,000,000 gates, 198 I/Os, 352-BFCQFP

The AX1000-1CQ352M is an Axcelerator family Field Programmable Gate Array (FPGA) built on Microchip’s AX architecture and antifuse programming technology. This single-chip, nonvolatile FPGA delivers deterministic timing, embedded memory and PLL-based clocking for high-performance, secure logic implementations.

Targeted at military-grade applications, the device combines 1,000,000 equivalent system gates with 18,144 logic elements and approximately 0.166 Mbits of embedded memory to support complex signal processing, protocol handling and secure hardware functions.

Key Features

  • Core Capacity — 1,000,000 equivalent system gates with 18,144 logic elements (cells), enabling dense logic implementations on a single device.
  • Embedded Memory and FIFOs — 165,888 total RAM bits (approximately 0.166 Mbits) with embedded FIFO control logic and configurable RAM block organizations for buffer and packet handling.
  • I/O Flexibility — 198 user I/Os on this part; family-level support for mixed-voltage, bank-selectable I/Os and high-speed differential standards (LVDS, LVPECL) including 700 Mb/s LVDS-capable channels.
  • High-Speed Performance — Family-level performance indicators include 350+ MHz system performance and 500+ MHz internal performance, with embedded PLLs supporting frequency synthesis up to 1 GHz.
  • Security and Nonvolatile Programming — Antifuse, single-chip nonvolatile solution with FuseLock programming technology to protect against reverse engineering and design theft.
  • Clocking and Timing — Segmentable clock resources and embedded PLLs for flexible clock distribution and deterministic, user-controllable timing.
  • Package and Mounting — Supplied in a 352-BFCQFP with tie bar; supplier device package listed as 352-CQFP (75x75). Surface mount package suitable for board-level integration.
  • Operating Range — Military-grade operating temperature from -55°C to 125°C and core supply specified at 1.425 V to 1.575 V. RoHS compliant.

Typical Applications

  • Defense and Secure Systems — Nonvolatile antifuse programming and FuseLock protection provide hardware-level security appropriate for mission-critical and defense electronics.
  • High-Speed Data Interfaces — LVDS-capable I/Os and embedded FIFOs support high-throughput serial links, data acquisition front-ends and protocol bridging.
  • Signal Processing and Acceleration — Large logic capacity and on-chip RAM enable hardware-accelerated DSP functions, packet processing and custom compute blocks.
  • Clock-Dependent Designs — Segmentable clocks and embedded PLLs facilitate complex clocking schemes required by synchronous, multi-rate systems.

Unique Advantages

  • Single-Chip, Nonvolatile Solution: Antifuse architecture removes the need for external configuration memory and ensures the device retains its programmed configuration without power.
  • Design Security: FuseLock programming technology and one-time antifuse programming reduce risk of reverse engineering and intellectual property theft.
  • Deterministic Timing: Segmentable clocks, routing architecture and PLLs provide user-controllable, deterministic timing for time-critical designs.
  • High Logic and Memory Integration: Combination of 1,000,000 gates, 18,144 logic elements and 165,888 bits of embedded RAM minimizes external components and simplifies board-level BOM.
  • Military-Grade Thermal Performance: Rated for -55°C to 125°C operation to meet demanding environmental requirements.
  • Flexible I/O Standards: Support for mixed-voltage banks and differential standards enables interoperability with a broad range of legacy and modern interfaces.

Why Choose AX1000-1CQ352M?

The AX1000-1CQ352M positions itself as a high-capacity, secure, nonvolatile FPGA option for designs that require significant on-chip logic, embedded memory and deterministic clocking. Its antifuse programming and FuseLock protection address hardware security needs while the device’s PLLs, FIFOs and flexible I/O support high-performance data paths and complex system integration.

This device is well suited for engineers building defense, high-speed communications and advanced signal-processing systems where long-term stability, design security and robust thermal performance are essential. The combination of logic density, embedded resources and single-chip nonvolatile operation reduces system complexity and supports reliable, long-life deployments.

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