AX1000-1BG729M
| Part Description |
Axcelerator Field Programmable Gate Array (FPGA) IC 516 165888 729-BBGA |
|---|---|
| Quantity | 625 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 52 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 729-PBGA (35x35) | Grade | Military | Operating Temperature | -55°C – 125°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 729-BBGA | Number of I/O | 516 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 18144 | Number of Logic Elements/Cells | 18144 | ||
| Number of Gates | 1000000 | ECCN | 3A001A2C | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 165888 |
Overview of AX1000-1BG729M – Axcelerator FPGA, 516 I/Os, ~0.166 Mbits Embedded RAM, 729-BBGA
The AX1000-1BG729M is an Axcelerator family Field Programmable Gate Array (FPGA) from Microchip Technology based on the AX antifuse architecture. This single-chip, nonvolatile FPGA combines high logic capacity with embedded memory, multiple PLLs and flexible multi-standard I/Os to address demanding, high-reliability designs.
Designed and specified for military-grade operation (–55 °C to +125 °C) and delivered in a 729-ball BGA package, the device targets applications that require deterministic timing, secure programming and robust performance across wide temperature and voltage ranges.
Key Features
- AX antifuse architecture (nonvolatile) Single-chip, nonvolatile solution with FuseLock™ programming technology for protection against reverse engineering and design theft.
- Logic capacity Approximately 1,000,000 equivalent system gates implemented as 18,144 logic elements for complex, high-density logic integration.
- Embedded memory 36 core RAM blocks totaling 165,888 bits of on-chip RAM (approximately 0.166 Mbits) with variable-aspect 4,608-bit blocks and embedded FIFO control logic.
- I/O and interface flexibility 516 user I/Os with bank-selectable, mixed-voltage operation (1.5V, 1.8V, 2.5V, 3.3V) and support for single-ended and differential standards including LVDS and LVPECL; up to 700 Mb/s LVDS-capable I/Os.
- Clocking and PLLs Multiple segmentable clocks and embedded PLLs (family-level PLL features include 14–200 MHz input range and frequency synthesis capabilities up to 1 GHz); AX1000 provides PLL resources for clock management.
- Performance System-level performance figures documented for the family include 350+ MHz system performance and 500+ MHz internal performance.
- Package and mounting Surface-mount 729-ball BGA (729-PBGA, 35×35 mm supplier package) optimized for high-density board designs.
- Power and operating range Core supply specified at 1.425 V to 1.575 V; operating temperature range −55 °C to +125 °C, meeting military-grade thermal requirements.
- Design and test support Deterministic timing, boundary-scan (IEEE 1149.1) support and in-system diagnostic/debug capability documented for the Axcelerator family.
Typical Applications
- Defense & Aerospace systems Mission-critical processing, secure logic implementations and high-reliability control where military temperature range and nonvolatile configuration are required.
- High-speed communications Data path and protocol engine implementations that benefit from many I/Os, LVDS-capable interfaces and on-chip FIFOs for buffering and data alignment.
- Signal processing and instrumentation Deterministic timing and high internal performance for custom DSP pipelines, radar subsystems and real-time data acquisition.
- Secure IP and custom SoC functions One-time programmable antifuse technology and FuseLock™ protection for designs requiring high security and IP protection.
Unique Advantages
- Nonvolatile antifuse programming: Enables a single-chip, permanently configured solution that retains configuration without external memory.
- High logic density: ~1,000,000 equivalent gates and 18,144 logic elements allow consolidation of complex functions and reduce system BOM.
- Embedded RAM and FIFO control: 165,888 bits of on-chip RAM with programmable FIFO logic for tight data buffering and throughput optimization.
- Flexibility of I/O standards: Bank-selectable mixed-voltage I/Os and support for a wide set of single-ended and differential standards facilitate interface compatibility across subsystems.
- Military-grade thermal performance: Specified for −55 °C to +125 °C operation to support long-term reliability in harsh environments.
- Security and anti-reverse-engineering: FuseLock™ programming technology protects IP and prevents unauthorized readout or cloning of the programmed device.
Why Choose AX1000-1BG729M?
The AX1000-1BG729M combines Axcelerator antifuse technology with high logic density, embedded memory and broad I/O flexibility to deliver a robust, single-chip FPGA solution for demanding, secure and high-reliability designs. With military-grade temperature support, on-chip PLLs and deterministic timing features, it is well suited to customers building defense, aerospace, communications and real-time signal-processing systems.
Choosing this device reduces external configuration and memory requirements while providing secure, nonvolatile configuration and a compact footprint in a 729-BBGA package—making it a practical option for designs that prioritize long-term stability, security and integration.
Request a quote or submit an inquiry to get pricing and availability for AX1000-1BG729M and learn how it can be integrated into your next high-reliability design.

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