AX1000-1BG729M

IC FPGA 516 I/O 729BGA
Part Description

Axcelerator Field Programmable Gate Array (FPGA) IC 516 165888 729-BBGA

Quantity 625 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time52 Weeks
Datasheet

Specifications & Environmental

Device Package729-PBGA (35x35)GradeMilitaryOperating Temperature-55°C – 125°C
Package / Case729-BBGANumber of I/O516Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs18144Number of Logic Elements/Cells18144
Number of Gates1000000ECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits165888

Overview of AX1000-1BG729M – Axcelerator FPGA, 516 I/Os, ~0.166 Mbits Embedded RAM, 729-BBGA

The AX1000-1BG729M is an Axcelerator family Field Programmable Gate Array (FPGA) from Microchip Technology based on the AX antifuse architecture. This single-chip, nonvolatile FPGA combines high logic capacity with embedded memory, multiple PLLs and flexible multi-standard I/Os to address demanding, high-reliability designs.

Designed and specified for military-grade operation (–55 °C to +125 °C) and delivered in a 729-ball BGA package, the device targets applications that require deterministic timing, secure programming and robust performance across wide temperature and voltage ranges.

Key Features

  • AX antifuse architecture (nonvolatile) Single-chip, nonvolatile solution with FuseLock™ programming technology for protection against reverse engineering and design theft.
  • Logic capacity Approximately 1,000,000 equivalent system gates implemented as 18,144 logic elements for complex, high-density logic integration.
  • Embedded memory 36 core RAM blocks totaling 165,888 bits of on-chip RAM (approximately 0.166 Mbits) with variable-aspect 4,608-bit blocks and embedded FIFO control logic.
  • I/O and interface flexibility 516 user I/Os with bank-selectable, mixed-voltage operation (1.5V, 1.8V, 2.5V, 3.3V) and support for single-ended and differential standards including LVDS and LVPECL; up to 700 Mb/s LVDS-capable I/Os.
  • Clocking and PLLs Multiple segmentable clocks and embedded PLLs (family-level PLL features include 14–200 MHz input range and frequency synthesis capabilities up to 1 GHz); AX1000 provides PLL resources for clock management.
  • Performance System-level performance figures documented for the family include 350+ MHz system performance and 500+ MHz internal performance.
  • Package and mounting Surface-mount 729-ball BGA (729-PBGA, 35×35 mm supplier package) optimized for high-density board designs.
  • Power and operating range Core supply specified at 1.425 V to 1.575 V; operating temperature range −55 °C to +125 °C, meeting military-grade thermal requirements.
  • Design and test support Deterministic timing, boundary-scan (IEEE 1149.1) support and in-system diagnostic/debug capability documented for the Axcelerator family.

Typical Applications

  • Defense & Aerospace systems Mission-critical processing, secure logic implementations and high-reliability control where military temperature range and nonvolatile configuration are required.
  • High-speed communications Data path and protocol engine implementations that benefit from many I/Os, LVDS-capable interfaces and on-chip FIFOs for buffering and data alignment.
  • Signal processing and instrumentation Deterministic timing and high internal performance for custom DSP pipelines, radar subsystems and real-time data acquisition.
  • Secure IP and custom SoC functions One-time programmable antifuse technology and FuseLock™ protection for designs requiring high security and IP protection.

Unique Advantages

  • Nonvolatile antifuse programming: Enables a single-chip, permanently configured solution that retains configuration without external memory.
  • High logic density: ~1,000,000 equivalent gates and 18,144 logic elements allow consolidation of complex functions and reduce system BOM.
  • Embedded RAM and FIFO control: 165,888 bits of on-chip RAM with programmable FIFO logic for tight data buffering and throughput optimization.
  • Flexibility of I/O standards: Bank-selectable mixed-voltage I/Os and support for a wide set of single-ended and differential standards facilitate interface compatibility across subsystems.
  • Military-grade thermal performance: Specified for −55 °C to +125 °C operation to support long-term reliability in harsh environments.
  • Security and anti-reverse-engineering: FuseLock™ programming technology protects IP and prevents unauthorized readout or cloning of the programmed device.

Why Choose AX1000-1BG729M?

The AX1000-1BG729M combines Axcelerator antifuse technology with high logic density, embedded memory and broad I/O flexibility to deliver a robust, single-chip FPGA solution for demanding, secure and high-reliability designs. With military-grade temperature support, on-chip PLLs and deterministic timing features, it is well suited to customers building defense, aerospace, communications and real-time signal-processing systems.

Choosing this device reduces external configuration and memory requirements while providing secure, nonvolatile configuration and a compact footprint in a 729-BBGA package—making it a practical option for designs that prioritize long-term stability, security and integration.

Request a quote or submit an inquiry to get pricing and availability for AX1000-1BG729M and learn how it can be integrated into your next high-reliability design.

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