AX1000-1BGG729

IC FPGA 516 I/O 729BGA
Part Description

Axcelerator Field Programmable Gate Array (FPGA) IC 516 165888 729-BBGA

Quantity 1,150 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time52 Weeks
Datasheet

Specifications & Environmental

Device Package729-PBGA (35x35)GradeCommercialOperating Temperature0°C – 70°C
Package / Case729-BBGANumber of I/O516Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs18144Number of Logic Elements/Cells18144
Number of Gates1000000ECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits165888

Overview of AX1000-1BGG729 – Axcelerator Field Programmable Gate Array (FPGA) IC 516 165888 729-BBGA

The AX1000-1BGG729 is an Axcelerator family FPGA based on Microchip’s AX architecture and CMOS antifuse programming technology. This single-chip, nonvolatile FPGA delivers up to 1,000,000 equivalent system gates with a high I/O count and embedded memory, making it suitable for high-performance digital designs that require deterministic timing and on-chip FIFO/memory resources.

With a 729-ball BGA package and commercial-grade operating range, the device targets system designs that demand dense logic, flexible mixed-voltage I/Os and integrated clocking and PLL resources for complex interfacing and data-path applications.

Key Features

  • Core Capacity — Approximately 1,000,000 equivalent system gates and 18,144 logic elements, providing substantial combinatorial and sequential resources for large designs.
  • Embedded Memory — 165,888 bits of on-chip RAM (approximately 0.166 Mbits) organized in multiple RAM blocks with embedded FIFO control logic for buffering and data-path operations.
  • I/O and Packaging — 516 user I/Os in a 729-ball BGA (729-PBGA, 35 × 35 mm) surface-mount package; supports mixed-voltage bank operation and high-density board integration.
  • High-Performance I/O Standards — Flexible multi-standard I/Os including single-ended and differential standards; LVDS-capable channels up to 700 Mb/s as documented for the Axcelerator family.
  • Clocking and PLLs — Segmentable clock resources and an embedded PLL offering wide input range and frequency synthesis capabilities for deterministic and user-controllable timing.
  • Power — Core supply range 1.425 V to 1.575 V, supporting the device’s low-voltage core operation.
  • Reliability and Programmability — Nonvolatile antifuse programming with FuseLock™ technology for design security and protection against reverse engineering.
  • Commercial Grade — Specified for 0°C to 70°C operating temperature and RoHS-compliant packaging.

Typical Applications

  • High-speed data interfaces — Use the device’s LVDS-capable I/Os and high I/O count for multi-channel serial or parallel data link implementations and protocol bridging.
  • Embedded buffering and packet handling — Leverage on-chip RAM and embedded FIFO logic for temporary storage, packet buffering, and streaming data paths.
  • Custom logic and system glue — Large logic capacity and mixed-voltage I/O support integration of complex control logic, bus interfacing and protocol conversion within a single device.

Unique Advantages

  • Nonvolatile single-chip solution: Antifuse-based programming provides a one-time programmable, nonvolatile configuration without external configuration memory.
  • High integration density: 18,144 logic elements and approximately 0.166 Mbits of embedded RAM reduce board-level components and simplify system design.
  • Flexible I/O standards: Bank-selectable, mixed-voltage I/Os and differential support enable direct interfacing to a wide range of devices and signaling standards.
  • Deterministic timing control: Segmentable clocks and embedded PLLs allow precise timing architectures and frequency synthesis for performance-sensitive applications.
  • Design security: FuseLock programming technology protects intellectual property by preventing reverse engineering of programmed designs.
  • RoHS-compliant packaging: Environmentally compliant packaging supports modern manufacturing requirements.

Why Choose AX1000-1BGG729?

The AX1000-1BGG729 positions itself as a high-capacity, nonvolatile FPGA option within the Axcelerator family, combining substantial logic resources, a high I/O count and embedded memory to address demanding data-path, interfacing and buffering tasks. Its antifuse programming and FuseLock security make it suitable for designs where one-time programming and IP protection are required.

This device suits engineering teams building commercial-temperature systems that need deterministic timing, mixed-voltage I/O flexibility and integrated PLL and FIFO functionality. The AX1000-1BGG729 delivers a compact, surface-mount solution for consolidating complex system logic onto a single FPGA package.

Request a quote or submit a product inquiry to discuss availability, pricing and integration support for AX1000-1BGG729.

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