AX1000-1BGG729I

IC FPGA 516 I/O 729BGA
Part Description

Axcelerator Field Programmable Gate Array (FPGA) IC 516 165888 729-BBGA

Quantity 650 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time52 Weeks
Datasheet

Specifications & Environmental

Device Package729-PBGA (35x35)GradeIndustrialOperating Temperature-40°C – 85°C
Package / Case729-BBGANumber of I/O516Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs18144Number of Logic Elements/Cells18144
Number of Gates1000000ECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits165888

Overview of AX1000-1BGG729I – Axcelerator Field Programmable Gate Array (FPGA) IC, 516 I/Os, 165,888‑bit RAM, 729‑BBGA

The AX1000-1BGG729I is an Axcelerator family FPGA from Microchip Technology implementing the AX architecture and antifuse programming technology. It delivers a single-chip, nonvolatile FPGA solution with deterministic timing and on-chip embedded memory, intended for designs that require high-performance, secure, and reliable logic integration.

This device combines high logic capacity, substantial embedded RAM, and a large I/O count in a 729‑ball BGA package for industrial applications that demand robust temperature range and board-level integration.

Key Features

  • Core Capacity — Approximately 1,000,000 equivalent system gates with 18,144 logic elements for complex logic integration.
  • Embedded Memory — Approximately 0.166 Mbits (165,888 bits) of on-chip RAM arranged as 36 core RAM blocks with embedded FIFO control logic for buffering and data handling.
  • I/O and Interfaces — 516 user I/Os; I/O standards include multi-voltage operation and high-speed differential options noted in the Axcelerator family (LVDS-capable up to 700 Mb/s).
  • Performance — Family-level performance characteristics include 350+ MHz system performance and 500+ MHz internal performance, with on-chip PLLs and segmentable clock resources for flexible clocking.
  • Power and Voltage — Core supply range 1.425 V to 1.575 V (nominal 1.5 V core voltage for low-power operation).
  • Packaging and Mounting — Surface-mount 729‑BBGA package (supplier package listed as 729‑PBGA, 35×35 mm) for compact board implementation.
  • Industrial Grade and Temperature — Industrial operating temperature range of −40 °C to 85 °C.
  • Security and Test — Family features include FuseLock™ programming to protect design IP, boundary-scan (IEEE 1149.1) support, and in-system diagnostic/debug capability with Microchip Silicon Explorer II.
  • Standards and Compliance — RoHS-compliant.

Typical Applications

  • High-speed data interfaces — Use the device’s LVDS-capable I/Os and embedded FIFOs to implement multi-gigabit interface buffering and protocol bridging.
  • Deterministic control logic — Leverage deterministic, user-controllable timing and segmentable clocks for timing-critical control and real-time processing functions.
  • Secure, single-chip implementations — Deploy the antifuse, nonvolatile fabric and FuseLock programming to protect IP in applications that need built-in security and nonvolatile configuration.
  • Memory-intensive logic — Use the 36 embedded RAM blocks and FIFO control logic for packet buffering, data queuing, and width-adaptable memory structures.

Unique Advantages

  • Single-chip nonvolatile solution: Eliminates external configuration memory and delivers instant, secure configuration at power-up.
  • High logic and I/O density: 1,000,000 equivalent gates and 516 user I/Os support complex designs and extensive board-level interfacing without multiple devices.
  • Embedded FIFO and RAM flexibility: Width-configurable embedded RAM blocks and programmable FIFO control logic simplify data buffering and interface width adaptation.
  • Deterministic timing and clocking: Segmentable clock resources and embedded PLLs provide controllable, high-performance clocking for timing-sensitive applications.
  • Design security and testability: FuseLock programming, boundary-scan compliance, and in-system diagnostic capability help protect IP and streamline production test and debugging.
  • Industrial robustness: Industrial temperature rating (−40 °C to 85 °C) and RoHS compliance for deployment in regulated environments.

Why Choose AX1000-1BGG729I?

The AX1000-1BGG729I offers a balanced combination of high gate count, substantial embedded memory, and a large I/O set within a compact 729‑BBGA package—suitable for engineers who need a secure, nonvolatile FPGA platform with deterministic performance. Its family-proven architecture provides PLLs, segmentable clocks, and embedded FIFOs to address timing-critical and data-intensive designs.

Backed by Axcelerator family features such as FuseLock programming, boundary-scan testability, and in-system diagnostic support, the AX1000-1BGG729I is positioned for long-term integration where security, reliability, and predictable timing matter.

Request a quote or submit an inquiry to confirm pricing, availability, and lead times for AX1000-1BGG729I. Our team can provide technical information and ordering support tailored to your project needs.

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