AX1000-1FG896M

IC FPGA 516 I/O 896FBGA
Part Description

Axcelerator Field Programmable Gate Array (FPGA) IC 516 165888 896-BGA

Quantity 1,270 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package896-FBGA (31x31)GradeMilitaryOperating Temperature-55°C – 125°C
Package / Case896-BGANumber of I/O516Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs18144Number of Logic Elements/Cells18144
Number of Gates1000000ECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits165888

Overview of AX1000-1FG896M – Axcelerator FPGA, 1,000,000 gates, 516 I/Os, 896-BGA

The AX1000-1FG896M is an Axcelerator family field-programmable gate array (FPGA) by Microchip Technology built on the AX antifuse architecture. It delivers a one-million-equivalent-system-gate capacity with 18,144 logic elements and rich on-chip resources to support high-performance, secure programmable logic designs.

Designed for applications that require high I/O density, deterministic timing and nonvolatile configuration, this military-grade device provides a compact 896-BGA footprint, broad I/O flexibility and an extended operating range for use in demanding environments.

Key Features

  • Core Logic  Approximately 1,000,000 equivalent system gates and 18,144 logic elements provide substantial programmable logic capacity for complex designs.
  • Embedded Memory & FIFOs  Approximately 0.166 Mbits (165,888 bits) of on-chip RAM with embedded FIFO control logic and variable-aspect RAM blocks for width-configurable read/write ports.
  • I/O Flexibility  516 user I/Os with bank-selectable, mixed-voltage operation (1.5V, 1.8V, 2.5V, 3.3V) and support for single-ended and differential standards, including LVDS capability up to 700 Mb/s.
  • Clocking & PLLs  Segmentable clock resources and embedded phase-locked loop functionality (14–200 MHz input range with frequency synthesis capability up to 1 GHz) for flexible clock management.
  • Power & Supply  Core voltage supply nominally centered around 1.5 V (specified 1.425 V to 1.575 V) to match low-voltage FPGA system architectures.
  • Package & Mounting  896-ball fine BGA (896-FBGA, 31×31) in a surface-mount package for high density board-level integration.
  • Reliability & Security  Single-chip, nonvolatile antifuse programming with FuseLock™ programming technology to protect designs against reverse engineering and enable deterministic, user-controllable timing.
  • Operational Range  Military-grade temperature specification from −55 °C to +125 °C for deployment in harsh environments.

Typical Applications

  • Military & Aerospace Systems  High-density, military-grade FPGA for signal processing, protocol bridging and mission-critical logic in extreme temperature environments.
  • High-Speed Data Interfaces  LVDS-capable I/Os and embedded FIFOs suit high-throughput serial interfaces, data aggregation and real-time data buffering.
  • Secure and Protected Designs  Antifuse-based nonvolatile configuration and FuseLock™ security help protect intellectual property and enable tamper-resistant implementations.
  • Communications & Networking  Large logic capacity and extensive I/O count enable complex packet processing, protocol offload and custom switching functions.

Unique Advantages

  • High Logic Density: 1,000,000 equivalent gates and 18,144 logic elements allow consolidation of complex functions into a single device, reducing system board count.
  • Nonvolatile, Tamper-Resistant Configuration: Antifuse architecture with FuseLock™ secures designs and removes the need for external configuration memory.
  • Flexible, High-Speed I/O: 516 I/Os with multi-standard support and LVDS capability provide versatile interfacing for a wide range of sensors, transceivers and backplane connections.
  • Deterministic Timing & On-Chip Clocking: Segmentable clock resources and embedded PLLs enable precise, controllable timing for latency-sensitive designs.
  • Wide Thermal Range: Specified operation from −55 °C to +125 °C supports deployment in harsh or temperature-extreme environments.
  • Compact, High-Density Package: 896-FBGA (31×31) surface-mount package optimizes board area while providing abundant I/O.

Why Choose AX1000-1FG896M?

The AX1000-1FG896M positions itself as a high-capacity, secure and rugged FPGA solution for designs that demand substantial logic resources, broad I/O capability and nonvolatile configuration. Its combination of one million equivalent gates, extensive embedded memory/FIFO support and military-grade temperature range makes it well suited to applications where performance and reliability are essential.

Engineers building complex signal processing, secure communications or mission-critical control systems will benefit from the device's deterministic timing, on-chip PLLs and comprehensive I/O standards—enabling system consolidation, reduced BOM and long-term deployment stability.

Request a quote or submit an inquiry to receive pricing, lead-time and availability information for the AX1000-1FG896M.

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