AX1000-1FGG484M

IC FPGA 317 I/O 484FBGA
Part Description

Axcelerator Field Programmable Gate Array (FPGA) IC 317 165888 484-BGA

Quantity 475 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package484-FPBGA (23x23)GradeMilitaryOperating Temperature-55°C – 125°C
Package / Case484-BGANumber of I/O317Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs18144Number of Logic Elements/Cells18144
Number of Gates1000000ECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits165888

Overview of AX1000-1FGG484M – Axcelerator Field Programmable Gate Array (FPGA) IC 317 165888 484-BGA

The AX1000-1FGG484M is an Axcelerator family FPGA from Microchip Technology built on the AX antifuse architecture. It delivers a single-chip, nonvolatile FPGA solution with design-security features and system-level capabilities such as embedded SRAM/FIFO control logic and segmentable clocks.

Targeted for high-performance and security-aware embedded systems, this device provides 1,000,000 equivalent system gates, 18,144 logic elements, approximately 0.166 Mbits of embedded memory, and 317 user I/Os in a 484-FPBGA (23×23) package. The part is specified for military-grade operation with a wide temperature range and RoHS compliance.

Key Features

  • Core & Architecture  Antifuse-based AX architecture offering a single-chip, nonvolatile solution and FuseLock programming technology for protection against reverse engineering and design theft.
  • Logic Capacity  Approximately 1,000,000 equivalent system gates and 18,144 logic elements to support complex logic integration and high resource utilization.
  • Embedded Memory & FIFOs  Total embedded RAM of 165,888 bits (approximately 0.166 Mbits) with variable-aspect 4,608-bit RAM blocks and programmable FIFO control logic for flexible buffering and data-path design.
  • I/O Flexibility  317 user I/Os with multi-standard, bank-selectable I/O support (1.5V, 1.8V, 2.5V, 3.3V) and high-speed differential capability (LVDS at up to 700 Mb/s).
  • Clocking & Timing  Segmentable clock resources and embedded PLLs (14–200 MHz input range, frequency synthesis up to 1 GHz) for deterministic and user-controllable timing.
  • Performance  Family performance characteristics include 350+ MHz system performance and 500+ MHz internal performance for demanding designs.
  • Package & Power  484-FPBGA (23×23) surface-mount package; core supply specified at 1.425 V to 1.575 V (nominal 1.5 V).
  • Reliability & Test  Boundary-scan (JTAG) support and in-system diagnostic/debug capability via Microchip Silicon Explorer II; specified operating temperature −55°C to 125°C and grade: Military.
  • Standards & Compliance  RoHS-compliant device.

Typical Applications

  • Defense & Aerospace Systems  Military-grade temperature range and nonvolatile antifuse security make this device suited for secure, mission-critical electronic subsystems.
  • Communications Infrastructure  High-performance internal timing, PLL frequency synthesis, and 700 Mb/s LVDS-capable I/Os support high-speed data-paths and protocol bridging.
  • High-Security Embedded Systems  FuseLock programming technology and nonvolatile antifuse architecture provide enhanced protection for designs requiring IP protection and tamper resistance.
  • ASIC Replacement & Prototyping  1,000,000 equivalent system gates and substantial embedded RAM enable integration of complex logic that previously required ASIC solutions.
  • Industrial Control & Instrumentation  Deterministic timing, configurable I/Os, and robust temperature specification support demanding control and measurement applications.

Unique Advantages

  • Highly integrated FPGA: 1,000,000 equivalent system gates and 18,144 logic elements reduce external component count and simplify board-level design.
  • Nonvolatile, secure configuration: Antifuse architecture combined with FuseLock programming protects intellectual property and prevents configuration tampering.
  • Flexible embedded memory and FIFO control: 165,888 bits of embedded RAM and programmable FIFO logic enable efficient buffering and custom data-path widths.
  • Broad I/O standard support: Bank-selectable I/Os and multi-voltage operation (1.5V–3.3V) plus high-speed differential options provide interface flexibility across systems.
  • Deterministic timing and clocking: Segmentable clocks and embedded PLLs with wide input ranges support precise synchronous designs and high-frequency synthesis.
  • Rugged, tested platform: Military-grade temperature rating (−55°C to 125°C), surface-mount BGA packaging, JTAG boundary-scan, and diagnostic tooling support fielded, long-life applications.

Why Choose AX1000-1FGG484M?

The AX1000-1FGG484M positions itself as a secure, high-capacity FPGA for designs that require nonvolatile configuration, substantial logic and embedded memory, and flexible high-speed I/O. Its antifuse AX architecture and FuseLock programming technology provide a robust platform for protecting IP while delivering ASIC-level integration in a single device.

This device is well-suited for engineers and program managers developing defense/aerospace, communications, or other security-sensitive systems where deterministic timing, wide operating temperature, and reliable long-term operation are important. The combination of on-chip memory, PLLs, and configurable I/Os provides scalability and design consolidation across a range of complex applications.

Request a quote or submit a pricing and availability inquiry for AX1000-1FGG484M to receive detailed lead-time and procurement information.

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