AX1000-1FGG676M

The AX1000-1FGG676M is an Axcelerator antifuse FPGA based on Microchip's AX architecture, offering a single-chip, nonvolatile programmable solution with deterministic timing and hardware security. The device provides 1,000,000 equivalent system gates, 18,144 logic elements, approximately 0.166 Mbits of embedded memory, and 418 user I/Os, making it suited to designs that require high-density logic, embedded RAM/FIFO and flexible I/O.

Built on an advanced 0.15 µm CMOS antifuse process with seven metal layers, this military-grade part supports a core supply range of 1.425 V to 1.575 V and an operating temperature range of –55°C to 125°C, addressing applications that need wide temperature operation and nonvolatile configuration.

Key Features

• Core & Architecture 
  Antifuse-based Axcelerator architecture delivering up to 1,000,000 equivalent system gates and 18,144 logic elements for high-density programmable logic.
• Embedded Memory & FIFOs 
  Approximately 0.166 Mbits of embedded SRAM/FIFO with variable-aspect 4,608-bit RAM blocks and programmable FIFO control logic for flexible data buffering and memory configurations.
• Performance 
  Documented system performance of 350+ MHz and internal performance of 500+ MHz, plus high-performance embedded FIFOs and PLL-assisted clocking for demanding timing requirements.
• I/O Flexibility 
  418 user I/Os with multi-standard support (1.5V, 1.8V, 2.5V, 3.3V mixed-voltage operation), bank-selectable I/Os and support for single-ended and differential standards including LVTTL, LVCMOS, 3.3V PCI/PCI-X, LVPECL and LVDS. LVDS-capable channels support up to 700 Mb/s signaling.
• Clocking & PLL 
  Segmentable clock resources with embedded PLLs (14–200 MHz input range) and frequency synthesis capabilities up to 1 GHz.
• Security & Nonvolatile Configuration 
  Antifuse single-chip nonvolatile solution with FuseLock programming technology to protect against reverse engineering and design theft.
• Package & Mounting 
  676-ball fine BGA (676-FBGA, 27×27) surface-mount package, supporting compact board footprints.
• Power & Temperature 
  Core voltage supply range of 1.425 V to 1.575 V and military-grade operating range from –55°C to 125°C.
• Diagnostics & Test 
  Boundary-scan testing compliant with IEEE 1149.1 (JTAG) and in-system diagnostic and debug capability with Microchip Silicon Explorer II.
• Manufacturing Technology 
  Manufactured on an advanced 0.15 µm CMOS antifuse process with seven layers of metal for robust routing and performance.

Typical Applications

• Military and Avionics Systems 
  Military-grade temperature range and nonvolatile antifuse configuration suit mission-critical subsystems that require reliability across –55°C to 125°C.
• High-Speed Data Transport 
  LVDS-capable I/Os up to 700 Mb/s and embedded FIFOs enable high-bandwidth serial and parallel data buffering for communication modules and data concentrators.
• Signal Processing and Control 
  Large logic capacity and embedded SRAM/FIFO support computational and control tasks such as real-time signal processing and deterministic control logic.
• Secure, Deterministic Systems 
  FuseLock programming technology and single-chip nonvolatile configuration provide protection against reverse engineering and assure deterministic start-up behavior for secure platforms.

Unique Advantages

• Nonvolatile, Single-Chip Configuration 
  Antifuse technology eliminates external configuration memory and provides deterministic, one-time programmable configuration.
• High Logic Density 
  1,000,000 equivalent system gates and 18,144 logic elements enable consolidation of complex functions into a single FPGA, reducing BOM and board area.
• Flexible Mixed-Voltage I/Os 
  Bank-selectable mixed-voltage support (1.5V–3.3V) and broad protocol compatibility simplify interfacing to a wide range of peripherals and systems.
• Robust Clocking 
  Segmentable clocks and embedded PLLs (14–200 MHz input, synthesis up to 1 GHz) support complex timing architectures and high-speed local clocks.
• Designed for Harsh Environments 
  Military-grade operating temperature range and surface-mount 676-FBGA packaging support deployment in thermally demanding and space-constrained systems.
• Security-Focused Programming 
  FuseLock programming technology guards design IP by preventing reverse engineering of the programmed configuration.

Why Choose AX1000-1FGG676M?

The AX1000-1FGG676M positions itself as a high-density, nonvolatile antifuse FPGA for applications that require deterministic behavior, on-chip memory and high-speed I/O in a military-grade package. Its combination of 1,000,000 equivalent system gates, 18,144 logic elements, embedded SRAM/FIFO and flexible I/O standards enables designers to integrate complex logic, buffering and high-speed interfaces into a single device.

For teams focused on long-term robustness, security and predictable timing, this Axcelerator device provides a compact, manufacturable platform with documented performance characteristics, FuseLock protection, and debug/test support suitable for demanding applications in defense, communications and high-reliability electronics.

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