AX1000-1LG624M

IC FPGA 418 I/O 624CLGA
Part Description

Axcelerator Field Programmable Gate Array (FPGA) IC 418 165888 624-BCLGA

Quantity 528 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time52 Weeks
Datasheet

Specifications & Environmental

Device Package624-CLGA (32.5x32.5)GradeMilitaryOperating Temperature-55°C – 125°C
Package / Case624-BCLGANumber of I/O418Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs18144Number of Logic Elements/Cells18144
Number of Gates1000000ECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits165888

Overview of AX1000-1LG624M – Axcelerator Field Programmable Gate Array (FPGA) IC, 624-BCLGA, Military Grade

The AX1000-1LG624M is an Axcelerator antifuse FPGA from Microchip Technology based on the AX architecture and a 0.15 µm CMOS antifuse process with seven metal layers. It delivers a single-chip, nonvolatile programmable solution optimized for applications that require design security, deterministic timing, and high-performance logic integration.

With 1,000,000 equivalent system gates, 18,144 logic elements and approximately 0.166 Mbits of embedded memory, the device targets systems where performance, embedded SRAM/FIFO capability and military-grade environmental operation are required.

Key Features

  • Core Architecture AX antifuse architecture implemented in a 0.15 µm CMOS antifuse process with seven layers of metal, providing a nonvolatile single-chip solution and FuseLock programming protection.
  • Logic Resources Provides 1,000,000 equivalent system gates and 18,144 logic elements for complex logic integration and high resource utilization.
  • Embedded Memory Approximately 0.166 Mbits (165,888 bits) of on-chip SRAM/FIFO capacity with variable-aspect 4,608-bit RAM blocks and programmable FIFO control logic.
  • I/O and Interface Support Up to 418 user I/Os on this package with multi-voltage I/O capability and support for high-speed differential standards (LVDS up to 700 Mb/s as described in the Axcelerator family).
  • Performance & Timing System performance capability of 350+ MHz and internal performance up to 500+ MHz, plus segmentable clock resources and embedded PLLs (14–200 MHz input range, frequency synthesis up to 1 GHz).
  • Power Supply Core supply specified at 1.425 V to 1.575 V (nominal 1.5 V operation).
  • Package & Mounting 624-BCLGA package (supplier package 624-CLGA, 32.5 × 32.5 mm) with surface-mount mounting type suitable for high-density board designs.
  • Temperature & Grade Military-grade device with operating temperature range from −55 °C to 125 °C.
  • Diagnostics & Testability In-system diagnostic and debug capability with Microchip Silicon Explorer II and JTAG boundary-scan support (IEEE 1149.1).
  • Regulatory RoHS-compliant.

Typical Applications

  • Defense & Military Systems Military-grade thermal range and antifuse nonvolatile security make this device suitable for defense electronics that require robust environmental performance and protection against reverse engineering.
  • Secure Communications FuseLock programming technology and a nonvolatile antifuse architecture help protect proprietary designs used in secure communications equipment.
  • High-Speed Data Acquisition Embedded FIFOs, high internal performance and LVDS-capable I/Os support high-throughput data capture and streaming applications.
  • Deterministic Control Systems Segmentable clocks, deterministic timing and on-chip PLLs provide the timing stability needed for real-time control and embedded processing functions.

Unique Advantages

  • Nonvolatile, Secure Architecture: Antifuse technology with FuseLock programming protects designs from reverse engineering and preserves configuration without external configuration memory.
  • High Integration Density: 1,000,000 equivalent system gates and 18,144 logic elements enable consolidation of complex logic and state machines onto a single device, reducing board-level BOM.
  • Built-In High-Speed Memory and FIFOs: On-chip SRAM/FIFO blocks and programmable FIFO control reduce external memory requirements and simplify high-throughput data paths.
  • Deterministic Timing & Clocking: Segmentable clocks and embedded PLLs support stable, predictable timing architectures for real-time and timing-sensitive designs.
  • Military-Grade Operation: Specified for −55 °C to 125 °C operation and supplied in a robust 624-BCLGA package for demanding environmental conditions.
  • Comprehensive Test & Debug: In-system diagnostics with Silicon Explorer II and JTAG boundary-scan support speed development and production test cycles.

Why Choose AX1000-1LG624M?

The AX1000-1LG624M is positioned for designs that require a secure, nonvolatile FPGA with substantial logic capacity, embedded memory and deterministic performance. Its antifuse-based architecture and FuseLock programming provide protection for sensitive intellectual property while enabling high resource utilization and predictable timing behavior.

This device is well suited to engineers building military, secure communications, high-speed data acquisition or control systems that demand integrated FIFOs, segmented clocking and a wide operating temperature range. The combination of on-chip memory, PLL-based clock synthesis and a high logic density provides long-term value through reduced system complexity and robust operational characteristics.

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